Senior Engineer in Electronic Packaging Solutions

2 weeks ago

Seattle, Washington, United States Boeing Full time

Position: Senior Electronic Packaging Engineer
Company: Boeing Company

Location: USA - Tukwila, WA

Job Overview:
The Boeing Research & Technology division is on the lookout for a Senior Electronic Packaging Engineer to become an integral part of our team in Tukwila, Washington.

At Boeing, we are at the forefront of innovation, shaping the future of mobility, autonomy, and space exploration. Our mission is to connect people, products, and ideas globally while safeguarding nations and exploring the universe.

As part of our Research & Technology team, you will collaborate with engineers, scientists, and innovators to design cutting-edge communication systems for commercial aircraft, UAVs, and satellite technologies.

We invite you to bring your expertise and enthusiasm to help us build the future.


Key Responsibilities:

As a Senior Electronic Packaging Engineer, you will:

  • Lead the analysis of customer and system requirements, developing architectural strategies and detailed specifications for various electronic products.
  • Oversee the creation of high-level and detailed designs that align with established requirements and specifications.
  • Conduct thorough reviews of testing and analysis activities to ensure adherence to requirements.
  • Track and report on technical performance metrics to monitor progress and compliance.
  • Support Supplier Management with make/buy recommendations and provide other technical services.
  • Coordinate engineering support throughout the product lifecycle.
  • Plan research initiatives to conceptualize future product designs that meet anticipated needs.
  • Work with minimal supervision in a dynamic environment.

This role requires onsite presence at the designated location.


Qualifications:

To be considered for this position, you should possess:

  • A Bachelor's Degree or higher in engineering, computer science, mathematics, physics, or chemistry.
  • A minimum of 5 years of experience in microelectronics packaging, including MCM and heterogeneous integration.
  • Experience with complex packaging architectures and their impact on circuit performance.
  • Familiarity with EDA tool flows and vendor support related to chiplets and assembly.

Preferred qualifications include:

  • Over 10 years of relevant experience or a combination of education and experience.
  • Expertise in advanced packaging techniques, including ASIC and BGA.
  • Experience with 3DIC development flows and commercial microelectronics fabrication processes.

Additional Information:

This position is eligible for relocation based on candidate eligibility. Boeing is committed to a drug-free workplace and conducts testing for various substances as outlined in our policies.

Join us at Boeing, where we strive to deliver a comprehensive rewards package that attracts and retains top talent, including competitive pay and a variety of benefits.

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