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Sr. Staff Laser Module Packaging Engineer

1 month ago

Mountain View, United States Lightmatter Full time

Sr. Staff Laser Module Packaging Engineer

Lightmatter is redefining what computers and human beings are capable of by delivering a fundamentally new kind of computer that calculates using light. Transistors, the workhorse of modern computers, aren't improving at the rate they once were. To scale AI, companies are building increasingly large and energy-expensive data centers—a path that is neither financially nor environmentally sustainable. By delivering ultra-high performance and energy efficiency, Lightmatter’s compute engine will power rapid advancements in AI while lowering its environmental footprint.

LM is looking for a technical lead to drive Laser Module development required across multiple product lines for the company. As a technical leader, you will be leading a cross-functional team consisting of silicon photonics, analog, packaging and system engineers to drive various Laser Module development from concept to high volume production. You will be responsible to perform design optimization and assembly process flow development to deliver high yielding products while meeting reliability requirements. This position offers a unique opportunity to bring innovative concepts in laser technology to market. It provides significant opportunities to innovate by solving complex interactions across silicon photonics, packaging technologies and system architectures.

Responsibilities
  • Lead Laser Module development from concept phase through high volume manufacturing
  • Collaborate with silicon photonics, package & systems teams to define overall link budget, laser power requirements and perform laser module design and implementation trade-offs to deliver robust solution meeting performance, cost and reliability requirements.
  • Drive laser module design, layout studies, simulation as required, assembly process development and qualification strategies
  • Work closely with process integration, assembly, test and reliability engineers.
  • Actively manage suppliers and vendors to ensure timely project execution.
  • Be the lead technical point of contact for all the packaging & system related requirements for laser module development at LM and help define and deliver a laser module roadmap to meet product requirements.
  • Collaborate with cross-functional teams, including hardware designers, PCB layout engineers, and system architects to ensure seamless integration of the Laser Module and support throughout the product development lifecycle.
  • Document and communicate results, design guidelines, and recommendations to internal stakeholders, management, and customers.
  • Master’s degree; M.S./Ph.d. in Electrical or Mechanical Engineering, Physics, Material Science or relevant field
  • 10+ years of relevant industry experience in Semiconductor Laser technology and module development
  • Demonstrated experience in Laser Module Development, process integration and qualification.
  • Deep knowledge of different component (Mux, isolator, SOA, etc) requirements within a laser module and ability to design and optimize to meet product performance/reliability targets.
  • Understanding of packaging thermals and mechanical consideration such as heat transfer, and mechanical strain and stress. Ability to establish key interaction of photonic devices and package technology interaction; suggest methods to resolve and drive solutions.
  • Hands on experience with precision bonding processes including die-die edge attach, die to lens attach, and fiber attach processes.
  • Excellent communication skills, both verbal and written, to effectively collaborate with cross-functional teams and present findings to stakeholders.
  • Ability to work independently, lead a team, and manage multiple projects simultaneously

Preferred Qualifications

  • Working knowledge in photonics numerical simulation tools such as Zemax/Lumerical.
  • Working knowledge of Mechanical design processes and software experience using CAD/Solidworks.
  • Working knowing of various 2D/2.5D/3D packaging technologies.
  • Exposure to quality and reliability requirements for optical components