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Principal Electrical Engineer

3 months ago

Andover, United States Skyworks Solutions Full time

Press Tab to Move to Skip to Content Link Select how often (in days) to receive an alert: Principal Electrical Engineer - PA/RFIC Design

If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are

Connecting Everyone and Everything, All the Time . At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We value open communication, mutual trust, and respect. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates. Requisition ID: 73326 If you are looking to work on a wide range of technologies, architectures, and IP for next generation products, the Connectivity Technology group is the place for you. As part of a small, highly skilled team you will work with customers, marketing, product teams, and Skyworks Technology/Manufacturing group to identify critical needs for next generation Connectivity products. You will design, prototype, and validate new PA, Switch, LNA, & analog control circuits with the goal of delivering this IP for integration into the next generation of WiFi FEMs and new product segments. Job Description

Skyworks Solutions is seeking a Principal IC Design Engineer responsible for developing next generation RF power amplifiers and architectures for wireless front-end module products. This role involves working with SiGe HBT, GaAs HBT, and SOI technologies to develop and deliver next generation front-end module IP. Responsibilities include working with other technology team members and marketing to define and develop market leading PA solutions. You will conduct feasibility studies followed by design and tapeout of prototype ICs using linear and nonlinear simulation techniques and EM modeling. You will supervise IC layouts and design validation and present final results to the product design teams. The ideal candidate has experience with wide range of technologies and is comfortable collaborating with a range of stakeholders. Responsibilities

In support of the Connectivity technology roadmap, you will be responsible for exploring new architecture and designing/developing power amplifier test vehicles and IP. The candidate will support enablement and use of new technology by the product teams.

• Perform feasibility studies and lineup analysis for next generation power amplifiers designs • Explore simulation with new processes to meet the needs of Connectivity products and propose test applicable vehicles for development • Engage in all aspects of power amplifier design, simulation, & development using Cadence & ADS design tools • Perform comprehensive EM simulation of Power amplifier ICs and associated FEM matching circuits • Supervise PA IC layout, tapeout, & validation • Provide comprehensive presentations/reports on development results to the product development teams • Work with cross-functional teams from Foundry engineering, packaging, and test to realize advance prototypes. • Support development and execution of the overall Connectivity Technology roadmap

Required Skills

• BS with 12+ years of experience, MSEE with 8+ years, or Ph.D. with 5+ years • Proven skills in PA design and innovation in Silicon or GaAs HBT or CMOS technologies • Strong RF fundamentals such as impedance matching, distributed systems, passive RLC and resonant circuits, noise, linearity, bandwidth and stability. • Strong circuit simulation skills utilizing Agilent ADS and 2.5/3D EM tools such as EMX or HFSS • Strong problem solving and lab measurement/debugging skills. • Knowledge and advance packaging and CSP technologies applicable to FEM products. • Ability to execute project tasks with minimal supervision while collaborating where needed. • Effective oral and written communication skills. #LI-BW1 The typical base pay range for this role across the U.S. is currently USD

$124,400

-

$235,700 per year

. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits

include access to healthcare benefits (including a premium-free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others. Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock. These incentives and awards are based on individual and/or company performance. Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at accommodations@skyworksinc.com.

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