Principal Semiconductor Backside Lead Engineer

4 weeks ago

Andover, United States Raytheon Full time
  • An opportunity exists in the Advanced Microelectronics Solutions (AMS) Department, a part of Raytheon, for a Principal Semiconductor Backside Lead Engineer in the area of Backside Processing.
  • AMS develops, designs, and manufactures compound semiconductor devices, millimeter/microwave integrated circuits, focal plane arrays, and modules for defense and commercial applications.
  • Serve as a technical lead for a small team to achieve foundry metrics in the Backside Processing Work Center.
  • Develop, improve, and sustain backside wafer processes including wafer bond and de-bond, wafer thinning, and singulation.
  • Experience with semiconductor backside processing (e.g., wafer bond and de-bond, wafer thinning, and singulation).
  • Experience in design of experiments and use of statistical data analysis and statistical process control (SPC).
  • Experience training and certifying users on semiconductor processes and equipment.
  • DCSA Consolidated Adjudication Services (DCSA CAS), an agency of the Department of Defense, handles and adjudicates the security clearance process.

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