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Manufacturing Assembly Engineer

4 months ago

Boise, United States American Semiconductor Full time

𝐉𝐨𝐛 𝐃𝐞𝐬𝐜𝐫𝐢𝐩𝐭𝐢𝐨𝐧: 𝐌𝐚𝐧𝐮𝐟𝐚𝐜𝐭𝐮𝐫𝐢𝐧𝐠 𝐄𝐧𝐠𝐢𝐧𝐞𝐞𝐫 - 𝐀𝐬𝐬𝐞𝐦𝐛𝐥𝐲

𝐂𝐚𝐭𝐞𝐠𝐨𝐫𝐢𝐞𝐬: 𝐄𝐧𝐠. 𝟏 𝐚𝐧𝐝 𝟐 (𝐈𝐄𝐄𝐄 𝐞𝐪𝐮𝐢𝐯𝐚𝐥𝐞𝐧𝐭 𝐋𝐞𝐯𝐞𝐥 𝟏 - 𝟒)

𝐉𝐨𝐛 𝐒𝐮𝐦𝐦𝐚𝐫𝐲: The ideal candidate will support development of new manufacturing capabilities for package and board level assembly from prototype to volume manufacturing. The Manufacturing Engineer performs multiple engineering-related tasks in various assignments within the organization. This includes independently evaluating, selecting, and applying standard engineering techniques, procedures, and criteria, using judgment in making adaptations and modifications. Assignments have clear and specified objectives. This position requires a hands-on engineer willing to tackle multiple new technological challenges.

𝐑𝐞𝐬𝐩𝐨𝐧𝐬𝐢𝐛𝐢𝐥𝐢𝐭𝐢𝐞𝐬:  

• Develop and implement new capabilities for board level processing

• Flex board assembly with state-of-the-art ultra-thin flexible SoP 

    CSP ICs and SMT 

• Define, develop and optimize flip-chip thin device assembly 

    equipment and processes

• Define manufacturing processes and rules for their use by other 

    team members

• Work with technical cross-functional teams and customers 

 𝐒𝐤𝐢𝐥𝐥𝐬:

• Manufacturing experience in board assembly, pick-and-place of 

    SMT components and die

• Excellent analytical and problem-solving skills, SPC, JMP and similar 

• Familiar with the use of assembly tools, electronics, robotics and 

    vision systems

• Familiar with installation, start-up, utilization, application and 

     sustaining capital equipment

• Ability to work well with others

𝐃𝐞𝐬𝐢𝐫𝐞𝐝 𝐩𝐫𝐞𝐯𝐢𝐨𝐮𝐬 𝐞𝐱𝐩𝐞𝐫𝐢𝐞𝐧𝐜𝐞: Academic or manufacturing experience with rigid, flexible or rigid-flex circuit board assemblies, Automated flip-chip assembly, Stencil printing or related semiconductor package or board assembly. 

𝐏𝐞𝐫𝐬𝐨𝐧𝐚𝐥 𝐭𝐫𝐚𝐢𝐭𝐬: Interests advanced packaging including FCB, SiP, heterogeneous integration, chiplets and similar. Pro-active, innovative and energetic. Must have a can-do attitude, hands-on and able to multi-task. Aptitude and ability to make things is highly valued, very helpful and should be evidenced by manufacturing experience, assembly experience or non-work-related computer, electronic, electrical or hardware fabrication.

𝐄𝐝𝐮𝐜𝐚𝐭𝐢𝐨𝐧 𝐚𝐧𝐝 𝐄𝐱𝐩𝐞𝐫𝐢𝐞𝐧𝐜𝐞: 𝐁.𝐒. 𝐨𝐫 𝐌.𝐒. 𝐢𝐧 𝐄𝐧𝐠𝐢𝐧𝐞𝐞𝐫𝐢𝐧𝐠 𝐨𝐫 𝐫𝐞𝐥𝐚𝐭𝐞𝐝 𝐝𝐞𝐠𝐫𝐞𝐞. 𝐒𝐞𝐦𝐢𝐜𝐨𝐧𝐝𝐮𝐜𝐭𝐨𝐫 𝐞𝐱𝐩𝐞𝐫𝐢𝐞𝐧𝐜𝐞 𝐩𝐫𝐞𝐟𝐞𝐫𝐫𝐞𝐝.

𝐂𝐨𝐦𝐩𝐞𝐧𝐬𝐚𝐭𝐢𝐨𝐧: Salary is based on the level of applicable education and experience. This position may include stock options for participation in the growth of the company. Medical benefits are part of the total compensation package. 

𝐀𝐝𝐯𝐚𝐧𝐜𝐞𝐦𝐞𝐧𝐭: Future advancement in all corporate areas is possible.

𝐔.𝐒. 𝐖𝐨𝐫𝐤 𝐒𝐭𝐚𝐭𝐮𝐬: Only local candidates (Boise, Idaho) or those willing to relocate at their own expense will be considered. Due to the nature of our work, this position requires the ability to obtain and maintain a Department of Defense security clearance.