Principal Microelectronic Packaging Mechanical Design Engineer
2 weeks ago
Category: Engineering
- Telecommute: Yes-May consider hybrid teleworking for this position
- Shift: Days (United States of America)
- Travel Required: Yes, 10% of the Time
- Relocation Assistance: Relocation assistance may be available
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Northrop Grumman Mission Systems is seeking a Principal Mechanical Electronic Packaging Engineer/ Senior Principal Mechanical Electronic Packaging Engineer to join our team of qualified, diverse individuals. You will work as part of a cross-functional team that is responsible for the design and development of cutting-edge AESA antenna hardware that is featured in Northrop Grumman's world-class radar, ESM and communications systems, that are fielded on a multitude of airborne, marine, ground-based, and space military platforms. You'll support multiple projects spanning the product lifecycle, from R&D to full-rate production. Some example AESA products can be viewed at this website:
As an integral part of the Engineering and Sciences team, you will be responsible for the design and development of cutting-edge AESA antenna hardware that is featured in Northrop Grumman's world-class radar, ESM and communications systems.
This position may be filled as a Principal Mechanical Electronic Packaging Engineer or a Senior Principal Mechanical Electronic Packaging Engineer.
Design, prototyping and production support of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies
- effective and timely communication with peers in adjacent functions, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management and manufacturing.
- Organizing and prioritizing tasks in order to accomplish project milestones within schedule and budgetary constraints.
- Basic Qualifications for Principal Mechanical Electronic Packaging Engineer:
- Bachelor’s degree with 5 years of experience, a Master’s degree with 3 years of experience or a PhD with 0 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. S Citizenship with the ability to obtain/maintain an active DoD Secret Clearance
- Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate/PWB layout
- Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs
- Proficient with AutoCAD
- Familiarity with NX or other 3D modeling software
Basic Qualifications for Senior Principal Mechanical Electronic Packaging Engineer:
- Bachelor’s degree with 9 years of experience, a Master’s degree with 7 years of experience or a PhD with 4 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. S Citizenship with the ability to obtain/maintain an active DoD Secret Clearance
- Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate/PWB layout
- Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs
- Proficient with AutoCAD
- Familiarity with NX or other 3D modeling software
Advanced degrees in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
- Active DoD Secret Clearance or higher
- 100 engineering drawing practices
- Familiarity with thermal and structural analysis considerations, methodologies, and software tools
- Experience with hands-on assembly and testing of prototype electronic hardware
- This position is contingent on the ability to obtain or maintain a US Secret Clearance or higher.
As a full-time employee of Northrop Grumman Mission Systems, you are eligible for our robust benefits package including:
- Medical, Dental & Vision coverage
- Employee Assistance Programs & Work/Life Solutions
- The 9/80 schedule allows employees who work a nine-hour day Monday through Thursday to take every other Friday off.
In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.
The application period for the job is estimated to be 20 days from the job posting date. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class.
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