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Wafer Manufacturing Integration Engineer

2 months ago


San Jose, California, United States Western Digital Full time
Job Summary

Western Digital is seeking a highly skilled and motivated New College Graduate to join our Wafer Manufacturing Integration team in San Jose, CA. As a Wafer Manufacturing Integration Engineer, you will be responsible for generating and maintaining product routes in a high-volume wafer manufacturing environment, introducing new products to the manufacturing line, and delivering process, design, program, and process/tool qualification wafers in a timely manner.

Key Responsibilities
  • Wafer Failure Analysis and Troubleshooting: Perform thorough analysis of wafer failures, identify root causes, and implement corrective and preventive actions to ensure high-quality products.
  • Process Improvement and Collaboration: Serve as a focal point for continuous process improvement, working closely with cross-functional teams, including Manufacturing, Engineering, Design, Program, Yield, Quality, Equipment, and Development Teams, to drive process enhancements and optimize manufacturing efficiency.
Requirements
  • Education and Qualifications: PhD degree in physics, chemistry, materials science, chemical engineering, or related engineering field, with a graduation date between September and December 2024.
  • Communication and Teamwork Skills: Excellent communication skills, with the ability to work effectively in a cross-functional team setting, and a strong problem-solving mindset.
  • Technical Knowledge and Skills: Fundamental knowledge of wafer-level device fabrication techniques, including photolithography, thin film, plating, and CMP, as well as corresponding methodologies.
  • Project Management and Analytical Skills: Good project management, problem-solving, analytical, and presentation skills, with the ability to thrive in a high-paced dynamic environment and multi-task effectively.
Preferred Qualifications
  • Hands-on Experience: Hands-on experience in processing and characterization is desirable.
  • Wafer-Level Magnetic Recording Head Fabrication: Experience in wafer-level magnetic recording head fabrication is preferred.