Senior Staff Engineer Manufacturing/Packaging Expert

4 weeks ago


San Jose, California, United States Ethan Alexander Group, Inc. Full time

At Ethan Alexander Group, Inc., we are seeking a highly skilled Senior Staff Engineer Manufacturing/Packaging Expert to join our team. This role will be responsible for defining substrate/package design rules, process flow, and material set for new automotive power module packages.

The ideal candidate will have a strong background in semiconductor packaging technology, with a minimum of 12 years of experience. They will be responsible for driving alignment between module substrate (PCB) design requirements and supplier capabilities, enabling new product development and volume manufacturing of power modules.

The Senior Staff Engineer will also be responsible for developing new assembly technologies, running process DOE's, and defining process windows for new package development. They will work closely with offshore assembly and substrate partners to develop new processes and collaborate with multi-functional teams within Power Integrations for successful development, qualification, and production ramp of new module products.

Key responsibilities include:

  • Defining substrate/package design rules, process flow, and material set for new automotive power module packages
  • Driving alignment between module substrate (PCB) design requirements and supplier capabilities
  • Developing new assembly technologies and running process DOE's
  • Defining process windows for new package development
  • Working closely with offshore assembly and substrate partners to develop new processes
  • Collaborating with multi-functional teams within Power Integrations for successful development, qualification, and production ramp of new module products

Requirements include:

  • BS Degree in Electrical Engineering, Mechanical Engineering, or Material Science
  • Minimum 12 years of experience in semiconductor packaging technology
  • Experience leading multi-die packages
  • Understanding of organic laminate technologies manufacturing and supplier capabilities
  • Experience in SMT or passive integrated package assembly is a plus

Additional requirements include experience with packaging processes such as wafer back-grinding, wafer dicing, die attach, wire-bonding, molding, and package singulation. Knowledge of AEQ Automotive reliability requirements, APQP automotive development process, and JEDEC/IPC design standards is also required. Ability to set-up Design Rule Checks for verification of every aspect of the PCB layout is a plus.

This is an exciting opportunity for a skilled engineer to join our team and contribute to the development of innovative semiconductor technologies for high-voltage power conversion.



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