IP Project Engineer

3 weeks ago

Austin, Texas, United States NXP Semiconductors Full time
Job Title: IP Project Engineer

We are part of MCU/MPU Engineering, a central design organization within NXP Semiconductors. Our team develops products for multiple business lines in Automotive, Internet of Things (IoT), Networking, and Radio Frequency products. We have expertise in hardware engineering, including architecture, IP, and complete SoC Design.

The Digital IP team produces design solutions covering the extensive range of SoCs required by the business lines. The team is challenged to create industry-leading solutions covering very cost-sensitive, low-power devices to highly integrated, high-performance, multi-cohort devices compliant with the latest automotive and industrial safety and security standards.

Job Responsibilities:
  • Responsible for end-to-end execution & delivery of all IPs into the SoC
  • Evaluate and escalate IP quality or schedule risks to management
  • Drive technical challenges, discussions, and decision-making within the scope of IP
  • Make decisions on IP features using technical abilities
  • Make priority calls for IPs being delivered to an SoC
  • Work closely with IP design and verification teams and ensure compliance with methodology, sign-offs, and delivery timelines
  • Drive project meetings with IP development teams and track progress, risks, and feature change requests
  • Provide essential IP integration support to SoC; represent IP in SoC logic freeze and tape out reviews
  • Represent IP teams in audits with quality & safety organizations
Job Qualifications:
  • BSEE required, MSEE preferred, with 15+ years of industry-related experience
  • Good understanding of the IP development process and methodology
  • Experience with SoC Processor-based architectures is a plus
  • Experience in protocols like AHB/AMBA, Memory (ROM, RAM, Flash, LPDDR/DDR3/4), and memory controllers is a plus
  • Experience in all aspects of RTL design flow from Specification/Micro-architecture definition to design and verification, Timing Analysis, DFT, and Implementation a plus
  • Good understanding on Chip Assembly, IP Integration, RTL signoff tools and CDC/RDC/Lint/Synthesis
  • Able to work effectively with global teams; self-motivated to solve problems and manage deliverables
  • Excellent interpersonal and communication skills
  • Excellent leadership and negotiation skills

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