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Digital IC Design Principal Engineer
2 months ago
We are seeking a highly skilled Digital IC Design Principal Engineer to join our team at Raytheon Careers. As a key member of our team, you will be responsible for designing and developing cutting-edge digital visible and infrared image sensors.
Key Responsibilities- Design and implement innovative Readout Integrated Circuits for cutting-edge imaging systems, including digital blocks (1k – 1M gates) in a variety of CMOS nodes (from 180nm to 28nm).
- Collaborate in cross-functional integrated product development teams to deliver on customer requirements with consideration for efficiencies in strategic investment, cost, schedule, and process adherence.
- Train and guide junior engineers.
- BS, Electrical Engineering with 8 years of prior relevant experience
- MS, Electrical Engineering with 6 years of prior relevant experience
- PhD, Electrical Engineering with 4 years of prior relevant experience
- Experience with full Digital Design Flow that includes writing RTL using Verilog & SystemVerilog, constructing testbenches to perform RTL simulation & verification, performing Synthesis, Static Timing Analysis, Place-and-Route, DFT (with use of scan chains), and Logical Equivalence Check.
- Experience with Cadence tools such as Genus, Innovus, Conformal, Tempus, Modus, and/or Voltus, TCL scripting and Lint tools.
- U.S. citizenship is required.
- Experience with ROIC architecture, design concepts, operational control and timing.
- Experience writing behavioral models for digital circuits and analog/mixed signal interfaces and circuits.
- Experience with Conformal.
- Experience with a Digital-on-Top mixed-signal design flow including utilization of Innovus for final chip construction.
- Advanced degree.
- A total rewards package that goes above and beyond with compensation; healthcare, wellness, retirement, and work/life benefits; career development and recognition programs.
- Relocation if eligible.