Analog Design Lead

2 weeks ago


Cupertino, California, United States Apple Full time
Job Title: Analog Design Lead - Power Management

At Apple, we're looking for a highly skilled Analog Design Lead to join our team and contribute to the development of innovative power management solutions. As a key member of our team, you will be responsible for designing and developing high-quality, on-time silicon that meets the requirements of our mobile products.

Key Responsibilities:
  • Work with Systems and Platform teams to establish silicon requirements.
  • Lead efforts that develop, integrate, characterize, and test devices that include power regulators, chargers, backlight drivers, boost converters.
  • Deliver first revision functional silicon and production-worthy silicon per system requirements, on schedule.
  • Work with external vendors to ensure innovative design practices, methodologies, and processes are in place to produce quality results.
  • Ensure designs are accurately verified, validated, and tested for long-term reliability.
Requirements:
  • BS+10 years of relevant industry experience.
  • Expertise in power topologies such as buck, boost, buck-boost, charge pumps, LDOs.
  • Deep understanding of control architectures such as current mode, voltage mode, and hysteretic mode for applications including DC/DC converters, LED drivers, battery management circuits, LDOs, temperature sensors.
  • Strong understanding of semiconductor device physics, device safe-operating area (SOA), and power transistors used for high-frequency switching.
  • Solid understanding of DC/DC power converter modeling techniques using any of the following simulation tools such as MATLAB, Simplis, PSIM, or Spectre.
Preferred Qualifications:
  • Experience working in a team environment on mixed-signal ICs that integrate power management circuits, ADCs, DACs, and digital state machines.
  • Experience taking projects from the concept phase, through chip architecture, writing electrical specifications, process technology selection, die size estimation, managing schedules, IC design, layout supervision, layout extraction and verification, DRCs, LVS, LVL, mask and wafer fabrication monitoring, ATE lab correlation, corner lot characterization analysis, hands-on lab evaluation, release to production, yield improvement, and failure analysis support.

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