Senior Electronics Packaging Engineer

2 weeks ago

Severn, Maryland, United States Jacobs Full time

Your Contribution:

At Jacobs, we are committed to fostering an environment where you can excel and develop your career. With a global workforce of over 55,000 professionals, we provide a diverse and inclusive atmosphere that encourages innovation and collaboration. Our people are our greatest strength, and we offer a competitive compensation package to attract and retain top talent.

The Special Projects Division within our Rapid Solutions group operates with the agility of a small enterprise while leveraging extensive company resources. We are currently seeking a dedicated and driven individual to join our Mechanical Engineering team. As a Senior Electronics Packaging Engineer, you will utilize your engineering expertise in areas such as 3D CAD design, GD&T, thermal management, manufacturability considerations, structural analysis, and materials science to support various electronics packaging initiatives aimed at serving the Intelligence community. The designed systems must endure extreme conditions encountered in aerospace, maritime, and automotive applications worldwide, ensuring resilience against temperature fluctuations, thermal shocks, vibrations, structural impacts, moisture, and corrosion.

  • The Mechanical Engineering team is composed of high-performing professionals with extensive experience in mechanical design, electronics manufacturing, and packaging, as well as structural and thermal analysis.
  • The Senior Electronics Packaging Engineer will engage in the following responsibilities:
  • 3D CAD (Solidworks) design and drafting of mechanical and electro-mechanical components with an emphasis on reliability, manufacturability, and durability.
  • Conducting engineering analyses including thermal and structural evaluations, as well as tolerance assessments.
  • Proposing and implementing new engineering or manufacturing methodologies; contributing to enhancements of existing processes.
  • Effectively communicating technical progress to stakeholders while fostering a collaborative atmosphere.
  • Participating in engineering and product design reviews.
  • Providing estimates for engineering efforts related to ongoing projects and proposals.
  • Planning and executing thermal testing of electronics to validate design and simulation outcomes.
  • Fabricating, assembling, and qualifying initial engineering prototypes.
  • Designing and conducting laboratory experiments to assess material choices and advanced electronic packaging processes.
  • Collaborating across engineering disciplines to achieve project objectives.
  • Developing qualification plans for engineering requirements and workmanship verification.
  • Identifying technical risks and formulating mitigation strategies with the project team; presenting solutions to management.
  • Researching and identifying capable vendors; evaluating and selecting suitable vendors while serving as the primary technical liaison.
  • Other duties as assigned.

Qualifications:

  • U.S. Citizenship is required.
  • Ability to obtain and maintain a security clearance.
  • Bachelor's degree in Mechanical Engineering, Electro-Mechanical Engineering, Manufacturing Engineering, Materials Science Engineering, or a related field from an ABET accredited institution.
  • 8 to 12 years of experience in the mechanical packaging of electronic components or systems (higher experience levels will also be considered).
  • Proficient in thermal design for electronic systems, including material selection for heat sinks, thermal interface materials, and adhesives.
  • Strong analytical and troubleshooting skills.
  • Experience in designing for electronics manufacturing processes.
  • Experience in PCB layout or providing electro-mechanical design guidance for PCB layout.
  • Familiarity with various electronics manufacturing processes (such as SMT, PCB fabrication, and solder chemistries).
  • Comprehensive knowledge of the electronics product development lifecycle.
  • Experience working in or leading multi-disciplinary project teams with strict timelines.
  • Effective time management and prioritization abilities.
  • Excellent written and verbal communication skills, complemented by a proactive attitude.

Preferred Qualifications:

  • Master's Degree with a focus on Electronics Packaging, Microelectronics, or Electronics Process Development.
  • Experience in designing for microelectronics manufacturing processes.
  • Experience in developing process maps.
  • Experience in selecting cable terminations and connectors.
  • Experience in wire routing and harness design.
  • Machine design and drafting experience.
  • Familiarity with robotics design and control systems.
  • Hands-on manufacturing experience (e.g., machining, hand soldering, harness fabrication).
  • Strong communication and interpersonal skills.
  • Experience in mentoring junior engineering staff.

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