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Senior Electronics Packaging Engineer

2 months ago

Severn, Maryland, United States Jacobs Full time

Your Contribution:

At Jacobs, we empower our employees to excel in their roles, fostering an environment where you can grow, develop, and thrive. With a global workforce of over 55,000 individuals across 40 countries, we provide a diverse and supportive atmosphere that values integrity and commitment to our people, clients, and communities. Our team is our most valuable asset, and we offer a competitive compensation package to attract and retain top talent.

The Special Projects Division within the Rapid Solutions group operates with the agility of a small enterprise while leveraging the resources of a larger organization. We currently have several exciting opportunities for qualified candidates. The Mechanical Engineering team seeks a passionate, driven, and diligent individual who takes pride in their work, embraces challenges, and is committed to excellence. As a Senior Electronics Packaging Engineer in the Special Projects division, you will apply your engineering expertise in areas such as 3D CAD design, GD&T, thermal management, manufacturability considerations, structural analysis, composite materials, radome design, and material properties to various electronics packaging initiatives serving the Intelligence community. The designed systems must perform reliably in extreme conditions encountered in aviation, maritime, and automotive environments worldwide, enduring temperature fluctuations, thermal shocks, vibrations, structural impacts, moisture, and corrosion.

  • The Mechanical Engineering group is a high-performing team with extensive experience in mechanical design, electronics manufacturing, and packaging, as well as structural and thermal analysis.
  • The Senior Electronics Packaging Engineer will contribute to various tasks, including 3D CAD (Solidworks) design and drafting of mechanical and electro-mechanical components with an emphasis on reliability, manufacturability, and durability.
  • Conduct engineering analyses such as thermal and structural assessments, as well as tolerance evaluations.
  • Propose and advocate for new engineering or manufacturing processes and procedures; contribute to enhancements of existing methods.
  • Communicate technical progress to stakeholders while fostering a collaborative environment.
  • Participate in engineering and product design reviews.
  • Provide estimates for engineering efforts required for ongoing projects and proposals.
  • Plan and execute thermal testing of electronics to validate design and simulation outcomes.
  • Fabricate, assemble, and qualify first-article engineering prototypes.
  • Design and conduct laboratory experiments to assess material selections and advanced electronic packaging manufacturing techniques.
  • Collaborate effectively across engineering disciplines to achieve project objectives.
  • Develop engineering qualification plans for requirement verification and workmanship standards.
  • Identify technical risks and devise mitigation strategies with the project team; present solutions to management.
  • Research and identify suitable vendors; evaluate and select vendors while serving as the primary technical liaison.
  • Other responsibilities as assigned.

Qualifications:

  • U.S. Citizenship is required.
  • Ability to obtain and maintain a security clearance.
  • Bachelor's degree in Mechanical Engineering, Electro-Mechanical Engineering, Manufacturing Engineering, Materials Science Engineering, or a related field from an ABET accredited institution.
  • 8 to 12 years of experience in mechanical packaging of electronic components or systems (higher experience levels will also be considered).
  • Proficient in thermal design of electronic systems, including the selection of materials such as heat sinks, thermal interface materials, and adhesives.
  • Strong analytical and troubleshooting skills.
  • Experienced in designing for electronics manufacturing processes.
  • Familiar with PCB layouts and providing electro-mechanical design guidance.
  • Knowledgeable about various electronics manufacturing processes (e.g., SMT, PCB fabrication, polymer applications, solder chemistries).
  • Proficient understanding of the electronics product development lifecycle.
  • Experience in leading or participating in schedule-driven, multidisciplinary project teams.
  • Effective time management and prioritization abilities.
  • Excellent written, verbal communication, and interpersonal skills, along with a proactive attitude.

Preferred Qualifications:

  • Master's Degree with a focus on Electronics Packaging, Microelectronics, or Electronics Process Development.
  • Experience in designing for microelectronics manufacturing processes.
  • Proficient in developing process maps.
  • Experience in selecting cable terminations and connectors.
  • Knowledge of wire routing and harness design.
  • Experience in machine design and drafting.
  • Familiarity with robotics design and control systems.
  • Hands-on manufacturing experience (e.g., machining, hand soldering, harness fabrication).
  • Strong writing, communication, and interpersonal skills.
  • Experience in mentoring junior engineering staff.