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Optoelectronics Project Engineer
2 months ago
Overview
OSI Systems companies have a rich legacy of crafting innovative solutions aimed at enhancing the quality of life globally.
With over three decades of collective expertise in optoelectronics, our OSI Optoelectronics (OSIO) division stands as a prominent manufacturer of both standard and bespoke photodiodes and optical sensors, serving sectors such as aerospace, defense, commercial, and medical.
As one of the leading global producers of optoelectronic devices, we provide comprehensive engineering design support alongside manufacturing capabilities, catering to the defense, aerospace, medical, and industrial markets, among others.
Our state-of-the-art manufacturing facilities located in the U.S., India, and Malaysia enable us to deliver exceptional engineering solutions while maintaining efficient production processes to meet high-volume demands.
Position Summary
OSI Optoelectronics is in search of a Project Engineer to support various military, aerospace, and space-level microelectronics and optoelectronic initiatives.
Key Responsibilities
- Develop and propose package designs and selections.
- Define silicon chip attachment methods and suggest electro-optical testing parameters.
- Create assembly sequences and process travelers.
- Recommend material selections and specific component requirements necessary for successful program launches.
- Review all program aspects for schedule adherence, risk management, and recovery from unforeseen delays.
- Communicate program status to sales and customers of the Hi-Rel Program, often on a weekly or daily basis.
- Collaborate with Test Engineering, Quality Engineering, Device Engineering, Document Control, Process Engineering, Planning, and Purchasing to lead efforts ensuring successful documentation, material procurement, silicon wafer starts, and unique specification generation.
- Provide ongoing engineering support to assigned programs.
Uphold the core values of Integrity, Innovation, Accountability, and Teamwork.
All employees are responsible for reporting any quality issues or defects to their manager or senior management to facilitate corrective actions and prevent recurrence.
Qualifications
- Bachelor’s degree in Electrical Engineering or a related field is required; Mechanical/Electrical Engineering is preferred; relevant hands-on experience may substitute for formal advanced education.
- A minimum of 3 years of experience in Product or Project Engineering within semiconductor manufacturing is required, including direct involvement with line manufacturing, development coordination, documentation, process activities, customer communication, problem-solving, project status updates, and reliability reporting.
- Familiarity with manufacturing processes such as die attach, wirebond, die shear, fine and gross leak testing, wirebond pull, and hermetic sealing is essential.
- Technical expertise in microelectronics and photonics, particularly with silicon, InGaAs diode, and GaAs technology, is required.
- Knowledge of military standards is necessary.
- Experience with mechanical design tools (AutoCAD, Solid Works, etc.) for custom packaging and substrate configurations is preferred.
- Ability to fulfill job responsibilities across different time zones, including participation in late-night or early-morning meetings via phone or web, is essential.
