IC Package Design Engineer

1 month ago

San Diego, California, United States Apple Full time
Job Summary

We are seeking a highly skilled IC Package Design Engineer to join our team at Apple. As a key member of our Hardware Technology Packaging team, you will be responsible for inventing, designing, developing, and integrating electronic packaging solutions for Apple's internal and custom external components of hardware for its consumer electronic products.

In this role, you will own and drive sophisticated package selection, new generation product package structure, and configuration optimization. You will be responsible for Package/SIP/module physical design and layout, optimization, DV, and tape out; and work with multi-functional teams to achieve optimized mechanical/electrical/thermal performance for various types of chips.

Key Responsibilities
  • Implement the physical design of packages and modules for SoC, Memory, RF, and cellular chips.
  • Interface and coordinate with multi-functional groups throughout Apple on new product package/SiP/module feasibility analysis, design, and selection.
  • Define and develop design verification and automation strategy to strengthen and streamline package design as well as release flows.
  • Work multi-functionally to optimize package pin out.
  • Perform extraction of S-parameters and package RLGC model.
  • Ensure package design is optimized with SI/PI requirements.
  • Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution.
  • Explore, evaluate, and develop new CAD tool, design, and verification flow.
  • Partner with Silicon PD team to optimize chip Floorplan and bump placement, and minimize package size.
Requirements
  • BS and 10+ years of relevant industry experience.
Preferred Qualifications
  • Proven fundamentals in the electrical/material/thermal/or mechanical engineering field(s).
  • Familiarity with various sophisticated package configurations and assembly/substrate technology (wirebond, POP, etc.).
  • Experience in package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools.
  • Basic understanding in some SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.), package model extraction, S-parameters, and RLGC model.
  • Basic knowledge of substrate manufacturing process, structure, design rules, and material property.
  • Proven understanding of high-speed interfaces, including DDR, PCIe, NAND, etc.
  • Exposure to Unix environment, scripting languages (PERL, Python, TCL, and/or shell) and methodology.
Additional Requirements

At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $166,600 and $296,300, and your base pay will depend on your skills, qualifications, experience, and location.

Apple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple's Employee Stock Purchase Plan.

You'll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses — including tuition.

Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation.

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