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Focal Plane Array Packaging Specialist

2 months ago

Camarillo, California, United States Jobot Full time
Focal Plane Array Packaging Specialist - Innovative Solutions + Comprehensive Benefits This position is hosted by Jobot.
About Us: We are a leading high-tech firm specializing in infrared, laser, and sensor technologies. Our core values emphasize the importance of our workforce and our clients, ensuring that our employees are prioritized to maintain a competitive edge and deliver exceptional client experiences.
Why Work With Us? If you are eager to engage with some of the most advanced technologies available, we offer:
  • Meaningful Contributions
  • Industry-Leading Firm
  • Competitive Salary Package
  • Comprehensive Benefits
  • Flexible Work Arrangements
  • 401k Contributions
  • Accelerated Career Advancement
  • Engaging Company Events
  • Additional Perks
Position Overview We are in search of a highly skilled and motivated Packaging Engineer with expertise in Focal Plane Array (FPA) technology to become a vital part of our innovative team. The selected candidate will play a key role in the design and implementation of advanced packaging solutions for semiconductor wafers and dies. This role presents an excellent opportunity to apply your expertise in a stimulating and rewarding environment, significantly impacting the future of technology. Key Responsibilities: As a Packaging Engineer, your duties will encompass, but are not limited to:
  1. Developing and executing sophisticated packaging processes for wafers and dies, including die attachment and bonding.
  2. Collaborating with design, process, and reliability engineering teams to ensure seamless integration of FPAs into product packages.
  3. Conducting thorough analysis and characterization of packaging materials and processes to guarantee optimal performance.
  4. Designing and implementing experiments to validate innovative packaging concepts and technologies.
  5. Establishing and executing inspection and testing protocols to ensure the quality and reliability of packaged FPAs.
  6. Leading continuous improvement initiatives to enhance packaging efficiency, yield, and cost-effectiveness.
  7. Diagnosing packaging-related challenges and implementing effective solutions.
  8. Keeping abreast of the latest trends and advancements in packaging technology and integrating them into our processes.
Qualifications: To qualify for this exciting opportunity, candidates must possess:
  1. A bachelor's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related discipline; a master's degree or Ph.D. is preferred.
  2. A minimum of 3 years of experience in semiconductor packaging, particularly with FPA.
  3. Expertise in wafer and die packaging processes, including die attachment and bonding.
  4. Experience with infrared technology and flip-chip hybridization techniques.
  5. Strong understanding of semiconductor materials and their properties.
  6. Exceptional problem-solving abilities and the capacity to troubleshoot complex packaging challenges.
  7. Excellent communication and teamwork skills, enabling effective collaboration within cross-functional teams.
  8. The ability to manage multiple projects concurrently and meet stringent deadlines.
  9. A strong commitment to quality and continuous improvement.
This position offers a unique opportunity to collaborate with a talented group of engineers and contribute to the advancement of groundbreaking technology.