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Electronics Packaging Specialist

2 months ago

Camarillo, California, United States Attollo Engineering Full time
Job Title: Electronics Packaging Engineer

Attollo Engineering is a leading designer and manufacturer of cutting-edge infrared cameras and instruments for defense and industrial applications. Our company is committed to developing people to provide novel solutions for our customers. We offer competitive salary compensation, a generous insurance package, and 401K matching.

Job Summary

We are seeking an Electronics Packaging Engineer responsible for all back-end manufacturing processing, and post wafer (front-end) processing. Critical areas of responsibility include flip-chip hybridization, Lap & Polish, AR coating, epoxy die bonding and wire-bonding. This role requires qualification and calibration of FPA packaging processes, equipment, and tooling. The ideal candidate has a background in mechanical engineering and IR FPA manufacturing in a cleanroom environment and possesses knowledge of detector and ROIC wafer processing.

Key Responsibilities
  • Provide technical leadership in backend processing, including flip-chip hybridization, lap and polish, AR coating, wire-bonding and epoxy die attach/bonding.
  • Develop and improve processes focusing on process yield, capability, and throughput.
  • Apply knowledge of packaging, semiconductor processing, and device physics to enhance FPA development and innovation.
  • Uphold stringent cleanroom manufacturing standards, emphasizing safety, quality, and workflow efficiency.
  • Collaborate effectively with cross-functional teams, demonstrating project management skills to drive FPA packaging development projects from concept to completion.
  • Maintain rigorous documentation and adhere to industry protocols, ensuring consistent quality and compliance.
  • Lead and mentor team members, promoting a results-driven culture of continuous improvement.
Requirements
  • BS or MS in Physics, Material Science, Electrical Engineering, Mechanical Engineering, Industrial Engineering or related fields with a minimum of 3-5+ years.
  • Expertise in semiconductor packaging, including wire bonding and epoxy die attach/bonding.
  • Experience with specialty equipment qualification and calibration; ability to troubleshoot specialty equipment and custom tooling (in coordination with Equipment Engineering).
  • Strong excel and data analysis skills; familiarity with data analysis software packages such as JMP is preferred.
  • Knowledge of statistical process control (SPC) and six-sigma practices.
  • Experience working hands-on in a cleanroom manufacturing environment.
  • Proven ability to work in a team-oriented, fast-paced environment, managing multiple priorities and projects with efficiency and reliability.
  • Strong analytical skills, detail-oriented, with a commitment to quality and safety.
  • Proficiency with Microsoft 365 applications, including Excel, Word, and Outlook.
  • Excellent communication and interpersonal skills, with the capability to work collaboratively within cross-functional teams.
  • Adaptability and flexibility to changing priorities as required.
  • Position requires work on DoD contracts, and therefore qualified applications must be US Person (U.S. citizen or green card holder).
Preferred Skills
  • Background in IR FPA Packaging, particularly flip-chip hybridization techniques.
  • Setting up electronic test equipment and performing device screening.
  • Knowledge of semiconductor device physics, photodetectors, and FPAs.
  • Background in semiconductor processing.
  • Programming experience, Python in particular.

Attollo is an equal opportunity employer, including disability and protected veterans. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran.