IC Package Design Engineer

1 month ago

Irvine, California, United States Apple Full time
Job Description

At Apple, we're looking for a skilled IC Package Design Engineer to join our Hardware Technology Packaging team. As a key member of our team, you'll be responsible for inventing, designing, developing, and integrating electronic packaging solutions for Apple's internal and custom external components of hardware for its consumer electronic products.

Key Responsibilities:

  • Own and drive sophisticated package selection, new generation product package structure, and configuration optimization.
  • Implement the physical design of packages and modules for SoC, Memory, RF, and cellular chips.
  • Interface and coordinate with multi-functional groups throughout Apple on new product package/SiP/module feasibility analysis, design, and selection.
  • Define and develop design verification and automation strategy to strengthen and streamline package design as well as release flows.
  • Work multi-functionally to optimize package pin out.
  • Perform extraction of S-parameters and package RLGC model.
  • Ensure package design is optimized with SI/PI requirements.
  • Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution.
  • Explore, evaluate, and develop new CAD tool, design, and verification flow.
  • Partner with Silicon PD team to optimize chip Floorplan and bump placement, and minimize package size.

Requirements:

  • BS and 10+ years of relevant industry experience.
  • Proven fundamentals in the electrical/material/thermal/or mechanical engineering field(s).
  • Familiarity with various sophisticated package configurations and assembly/substrate technology (wirebond, POP, etc.).
  • Experience in package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools.
  • Basic understanding in some SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.), package model extraction, S-parameters, and RLGC model.
  • Basic knowledge of substrate manufacturing process, structure, design rules, and material property.
  • Proven understanding of high-speed interfaces, including DDR, PCIe, NAND, etc.
  • Exposure to Unix environment, scripting languages (PERL, Python, TCL, and/or shell) and methodology.

Preferred Skills:

  • Familiarity with CAM350/Valor or Calibre and CAD and experience with package design reviews.
  • Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs, EMI/RFI, PCB/package resonance).
  • Design experience with RFIC and 5G packages, SIP or module schematic and layout design experience.
  • Solid understanding of Design Rules Check and Design for Manufacturing.

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