Senior Package Design Engineer

4 days ago


California, United States Acceler8 Talent Full time

Job Summary

Acceler8 Talent is seeking a highly skilled Principal Package Design Engineer to join our client's team. As a key member of the design team, you will be responsible for the development of large-scale, complex package designs from concept through production.

Key Responsibilities

  • Collaborate with cross-functional teams to develop package specifications and perform analysis for high-speed serdes interfaces.
  • Conduct bring-up, testing, and characterization of high-speed serdes and memory interfaces.
  • Analyze HBM and other advanced packaging technologies.
  • Specify and analyze power and high-speed signaling requirements for high-speed networking systems across die, package, PCB, connectors, and cabling.
  • Work with systems engineers to define and implement thermal management solutions for high-power networking devices.
  • Provide support to operations team during package qualification and failure analysis processes.

Requirements

  • Minimum qualification of MS or PhD in Electrical Engineering (EE) or Mechanical Engineering (MechE), with over 10 years of relevant experience.
  • Proficient in hands-on design of large body size, high power, high speed substrates using Cadence APD/SIP.
  • Strong expertise in Signal Integrity (SI) and Power Integrity (PI), with mastery of Ansys HFSS and SiWave.
  • Familiarity with package and PCB materials and their properties.
  • Experience with 2.5D packaging and interposer integration is advantageous.
  • Demonstrated success in leading substrate layout engineering teams.
  • Direct involvement in production qualification and post-production activities.


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