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Fremont, California, United States Western Digital Full timeJob Title: Wet Process Development Engineer, Hardware Development EngineeringWe are seeking a talented and driven Process Development Engineer specializing in wafer wet process development (Chemical Mechanical Planarization (CMP), and Wet Process Development). Your role will involve enabling and accelerating HAMR technology deployment into HDD products.This...
Wafer Fabrication Process Engineer
2 months ago
We are seeking a highly skilled Process Engineer to join our team at Western Digital. As a key member of our manufacturing team, you will be responsible for enabling and accelerating technology deployment into head products to meet HDD new product requirements throughout the product life cycle.
Key Responsibilities- Maintain key parameter control within tight specifications for both manufacturing and development wafers in a high-volume 24x7 wafer fabrication environment.
- Create and modify recipes and set up Advanced Process Control (APC) on various CMP tools, ensuring seamless communication with primary process/metrology/integration engineers and production line teams.
- Partner with process development engineers and technicians to develop new CMP processes, methodologies, and consumables to meet new product launch requirements, schedules, and manufacturability.
- Lead the transfer of new processes from development to production, ensuring smooth ramp-up and implementation.
- Collaborate with cross-functional teams, including development, design, integration, and other process modules, to resolve integration issues and optimize designs incorporating CMP.
- Lead trouble-shooting efforts in production, conduct defect analyses, root cause analyses, and implement corrective and preventive actions to improve process capability, reduce cycle time, costs, and defects, and increase throughputs and line yield.
- Master's or Ph.D. degree in physics, chemistry, chemical engineering, materials science, or a related engineering field.
- Understanding of microelectronics wafer fabrication processes, including CMP, photolithography, dry or wet etching, electroplating, or thin film deposition processes.
- Manufacturing process engineering mindset, ability to work in a high-pace dynamic environment, and ability to multi-task.
- Experience in wafer-level magnetic recording head fabrication.
- Strong hands-on experience and willingness to work in a wafer fab environment.
- Strong background and experience in statistical data analysis and 6-sigma methodologies.
- Excellent communication skills, both written and oral, with the ability to work on issue resolution and interact with various interdepartmental teams and support organizations.
