Process Integration Engineer
2 weeks ago
GlobalFoundries is a leading full-service semiconductor foundry that provides a unique combination of design, development, and fabrication services to some of the world's most innovative technology companies.
With a global manufacturing footprint spanning three continents, GlobalFoundries enables the development of cutting-edge technologies and systems that transform industries and give customers the power to shape their markets.
For more information, visit our website.
New College Graduates OverviewWe offer various full-time employment paths for recent graduates, providing accelerated training in a fast-paced work environment, cross-functional working opportunities, and talent mobility.
New college graduates are provided with mentorship, networking, and leadership opportunities, which give our new team members lifelong connections and skills.
Summary of RoleWe are seeking a highly motivated individual with interest in semiconductor process and device development to work with our Technology Development team in advancing world-class differentiated semiconductor technologies for our 200mm manufacturing fabricator in Vermont (FAB9).
New hires will immediately embed within our project teams of process, integration, and device engineers in developing new process flows in CMOS, SiGe, and GaN technologies, targeting new and improved RF applications.
Essential Responsibilities Include- Innovate with integration and device team members in driving the integration of advanced process modules to meet performance, reliability, yield, and cost objectives.
- Interact with various colleagues in the broader fab teams that support technology development work, including test/characterization, failure analysis, unit process, reliability, manufacturing, and other research organizations, to facilitate and achieve program success.
- Support technology development qualification milestones from conception through manufacturing installation.
- Support experimental design and execution.
- Analyze experimental and performance results, including constructional analysis, and inline measurement summarization for manufacturing capability assessments and defect level assessments.
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
Required QualificationsPh.D. in Electrical Engineering, Solid State Physics, Microelectronics, Chemical Engineering, Material Science, or related field from an accredited degree program.
A basic knowledge of modern semiconductor device physics and device characterization, and of semiconductor processing.
Fluency in English Language – written & verbal.
Physical Capacity Demands – some amount of time required to work in a manufacturing clean room with product handling.
Proficiency in MSOffice and Statistical Analysis including Cpk, Design of Experiments.
Preferred QualificationsPrior related internship or co-op experience.
Project management skills - the ability to innovate and execute solutions that matter; the ability to navigate ambiguity.
Strong planning & organizational skills.
Demonstrated ability to meet deadlines and commitments.
Strong written and verbal communication skills.
Excellent interpersonal skills, energetic, motivated, and self-driven.
Educational experience in modern device physics (FET, BJT, LDMOS, and HEMT devices, bulk and SOI device structures). Including associated electrical test and analysis methods of discrete device structures.
Experience in semiconductor processing in CMOS, SiGe, and/or GaN technologies for RF applications.
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