Hybrid Assembly and Microelectronics Packaging Engineer

1 month ago

London, Kentucky, United States The Johns Hopkins University Applied Physics Laboratory Full time
Job Summary

We are seeking a highly skilled Hybrid Assembly and Microelectronics Packaging Engineer to join our Advanced Electrical Fabrication Group at The Johns Hopkins University Applied Physics Laboratory (APL). As a key member of our team, you will be responsible for furthering the development and fabrication of hardware used to solve challenging problems with significant bearing on national security, military readiness, space exploration, national health, and the advancement of fundamental science or engineering.

Key Responsibilities
  • Develop and fabricate hardware for advanced prototypes and one-of-a-kind systems that push the boundaries of scientific knowledge and national security.
  • Collaborate with internal and external partners to design and develop microelectronic and hybrid assemblies that meet their needs.
  • Communicate effectively with partners, engineers, technicians, and supervisors to ensure seamless project execution.
  • Design and create drawings using AutoCAD or Solidworks for assemblies, fixtures, and electrical test fixtures.
  • Perform hands-on microelectronics and hybrid assembly work, especially with new processes or assemblies.
  • Train and mentor other engineers and technicians on new processes and techniques.
  • Develop and communicate electronics assembly workorders using APL's work order system.
  • Maintain and adjust plans as the build progresses, ensuring timely completion and material availability.
Requirements
  • Bachelor's Degree in Electrical or Mechanical Engineering or equivalent work experience.
  • 5+ years of experience in Hybrid/microelectronic packaging.
  • Knowledge of microelectronics assembly and packaging technologies and techniques.
  • Excellent hands-on skills using typical microelectronics packaging tools and techniques.
  • Experience creating drawings using AutoCad, Solidworks, or other design software.
  • Excellent written and verbal communication skills.
  • Strong organizational skills and ability to work on multiple projects simultaneously.
  • Ability to work independently and as part of a team.
  • Manual dexterity to handle small components and ability to stand for extended periods.
  • Basic understanding of electrical circuits and components.
  • Ability to read drawings and schematics.
  • Ability to obtain a Top Secret level security clearance.
Preferred Qualifications
  • Masters's degree in Electrical or Mechanical Engineering or equivalent.
  • 10+ years of experience in Hybrid/microelectronic packaging.
  • Good working knowledge of Military and NASA Standards for hybrid microcircuits.
  • Working knowledge and experience in Heterogeneous Integration.
  • Ability to design packages, substrates, interposers, fixtures, printed wiring boards.
  • Ability to design simple electrical test fixtures.
  • Customer service experience.
About APL

The Johns Hopkins University Applied Physics Laboratory (APL) is a world-class research and development organization that brings expertise to the nation's most critical defense, security, space, and science challenges. We offer a vibrant, welcoming atmosphere where you can bring your authentic self to work, continue to grow, and build strong connections with inspiring teammates. APL is an Equal Opportunity/Affirmative Action employer and is committed to promoting an innovative environment that embraces diversity, encourages creativity, and supports inclusion of new ideas.

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