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Hardware Applications Principal Engineer

2 months ago

Santa Clara, United States Macpower Digital Assets Edge Private Limited (MDA Edge) Full time

Responsibilities:

As a Hardware Application Engineer your focus will be on resolving customer issues on their HW/platform, customer design enablement, bring-up, and manufacture production. You should have strong working knowledge of the major computer industry standards such as PCIe Express, Ethernet, and miscellaneous interface.

Debug L1 ethernet issues related to Serdes and MAC/PHY (analyze Signal Strength, Serdes Eye, Review & Tune SI parameters etc.).

Debug other interfaces on board such as PCIE, i2C, MDIO etc.

Perform Schematics and Layout reviews of the customer design/platform and provide feedback.

Interact with HW designers (board and ASIC) and write Hardware Design guidelines, Application Notes and publish Technical Bulletins.

Interface with board designers, ASIC /Serdes controller designers, program management, board vendors and component vendors to fully comprehend the board design parameters.

Generate PCB stack up recommendations that comprehend the full capabilities of industry available board fabrication materials and technologies.

Communicate effectively with customers considering both strategic and tactical aspects of the solution & work with internal cross-functional teams to deliver optimal solutions.

Key Requirements:

Bachelor's degree in Computer Science, Electrical Engineering or related fields and 10-15 years of related professional experience Or Master's degree and/or PhD in Computer Science, Electrical Engineering or related fields with 5-10 years of experience.

Must possess excellent written and verbal communication skills.

Must be able to present and clearly articulate solutions to customers.

Previous experience of working as an Application Engineer or any equivalent customer interacting role (i.e. ability to handle customers) is a must.

Expertise in High Speed Ethernet Serdes interfaces : NRZ, PAM-4 100G.

Expertise in Ethernet Physical layer (Layer 1) - Serdes, MAC, PCS including debugging L1 issues for Interop.

Strong background in Signal Integrity, Power Integrity, Electromagnetics, Thermal, Multi-lane cross talk analysis and RF applications related to IC Package and PCB Design are required.

Experience in using tools: HyperLynx, Ansoft SIWave and HFSS, ADS, Sigrity, PowerSI and PowerDC, Cadence Allegro, and Polar stack up

Able to performance Schematics & Layout reviews effectively

At least one scripting language : Python / Perl / Unix shell.

Nice to Have Skills:

Expertise in MATLAB and Python a plus.

Ability to handle Equipment: Servers (Windows / Linux), Scopes, Traffic generators (Ixia/Spirent/Xena), environmental chambers, Thermal Heads, Keysight VNA/TDR.

Ability to program High speed / optics modules and link up with various modules: LR, SR, ZR, ZR4, AECs etc.

Refer Talent, Earn Rewards: Your Network, Your Reward

We encourage you to refer friends and colleagues who may be a good fit for this role. As a gesture of appreciation for your referral, you will receive a 5% referral amount of the yearly salary of your referred candidate once they are hired by our client. This referral amount will be granted to you upon the completion of 120 days in their new position at our client