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Signal and Power Integrity Engineer

3 months ago


San Francisco, United States Eliyan Full time

Signal and Power Integrity Engineer Join the leading chiplet startup from the ground floor As a Signal and Power Integrity Engineer, you will provide packaging solutions for chiplet interconnects in a fast-paced early-stage startup creating technologies that fuel tomorrow’s chiplet-based systems with best-in-class power, area, manufacturability, and design flexibility. You will be responsible for design, modeling, manufacturing, assembly, and testing of traditional and advanced packaging for Eliyan’s chiplet solutions. You will work with a cross-functional team of industry experts that operate from first principles, innovate and push the envelope to create high-volume and high-performance manufacturable products. We offer a fun work environment with excellent benefits.

Key Responsibilities

Working closely with analog circuit designers to understand and define IO requirements co-designed with the channel Responsible for pre-layout and post layout channel simulation and optimization to achieve the best performance Using driver/receiver models to run transient channel simulation, inspect eye diagrams, and improve the performance Applying best practices for the design of power delivery networks, extracting models, and performing DC/AC/transient simulations Understanding substrate and interposer manufacturing design rules, assembly requirements, and driving the layout engineers to implement them Performing measurements in the lab, correlating with simulation, identifying issues and providing solutions Qualifications

Expertise in signal integrity and power integrity simulation methodologies Experience with simulation tools such as HFSS, Q3D, Siwave, PowerDC, PowerSI, ADS, Spectre, HSPICE, Allegro Knowledge of using lab equipment such as Vector Network Analyzer, Spectrum Analyzer, High-Frequency Oscilloscope BS degree in EE or equivalent, with 5 years of experience Will not relocate for this role at this time and onsite required Ideal Qualifications

Previous experience of IC packaging, manufacturing, and advanced package design Knowledge of SERDES design, IBIS-AMI model creation MS degree in EE or equivalent, with 7 years of experience

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