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Sr. Optical Packaging Engineer
2 months ago
Job Summary:
The
Sr. Optical Packaging Engineer
is responsible for developing & implementing a high-performance & robust fiber-to-chip package and a scalable packaging process for optical systems comprised of optical fibers attached to a variety of chip-based photonic integrated circuits.
Responsibilities:
Develop an optical package and fiber-to-chip alignment scheme that allows for high alignment accuracy and scalable assembly
Help develop packaging prototypes & scalable fiber-to-chip packaging flows, NPI
Review packaging design BOMs, work with supply chain on procuring parts needed for assembly
Establish and update version-controlled DFM requirements and feed back to packaging design group
Work with manufacturing group and vendors on transferring & scaling packaging designs and processes based on successful prototypes
Advise manufacturing group and vendors on setup of high-throughput packaging assembly lines
Work with external vendors and suppliers to source required materials and provide feedback on evolving requirements.
Mandatory experience/Qualifications:
Bachelor’s Degree or above in Engineering, Physics or Material Science.
10+ years of experience with/at semiconductor company or supplier working on PIC packaging design, qualification & multi-chip assemblies
5+ years of experience working with optical fibers, optical measurements
5+ years of work experience with advanced semiconductor packaging OSAT (Outsourced Semiconductor Assembly & Test) and/or EOL vendors
5+ years of experience with semiconductor company or supplier working on FAU / optical connector to chip attachment
Experience with fiber attach tooling & process/flow development and optical data analysis
Nice to have:
Experience with FA and 8D failure resolution techniques
Experience with developing metrics for yield and quality management, including reliability and yield based on optical and mechanical performance
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