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Test Engineer
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Camarillo, United States DEX Corporation Northeast Full timeJob DescriptionJob DescriptionDEX has been a leading global provider of supply chain solutions since 1980. DEX manufactures, distributes, and repairs electronic parts and assemblies for customers. While we specialize in hard-to-find parts, we source, manufacture, and repair an extensive range of parts across multiple verticals.For over 40 years, DEX has...
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Test Engineer
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Electronics Packaging Engineer
1 month ago
Attollo Engineering is a designer and manufacturer of cutting-edge infrared cameras and instruments for defense and industrial applications. Attollo has a full sensor fabricating facility and is a leading supplier of IR sensors in the defense and industrial space. Attollo believes in developing people to provide novel solutions for our customers. Attollo provides competitive salary compensation, a generous insurance package, and 401K matching.
Attollo Engineering is seeking an FPA Packaging Engineer responsible for all back-end manufacturing processing, and post wafer (front-end) processing. Critical areas of responsibility include flip-chip hybridization, Lap & Polish, AR coating, epoxy die bonding and wire-bonding. This role requires qualification and calibration of FPA packaging processes, equipment, and tooling. The ideal candidate has a background in mechanical engineering and IR FPA manufacturing in a cleanroom environment and possesses knowledge of detector and ROIC wafer processing. The successful candidate understands the importance of working as a team, optimizing manufacturing processes, sharing best practices, creating work instructions and training. This role requires the ability to juggle multiple priorities and projects in a fast-paced environment.
Role and Responsibilities
- Provide technical leadership in backend processing, including flip-chip hybridization, lap and polish, AR coating, wire-bonding and epoxy die attach/bonding.
- Develop and improve processes focusing on process yield, capability, and throughput.
- Apply knowledge of packaging, semiconductor processing, and device physics to enhance FPA development and innovation.
- Uphold stringent cleanroom manufacturing standards, emphasizing safety, quality, and workflow efficiency.
- Collaborate effectively with cross-functional teams, demonstrating project management skills to drive FPA packaging development projects from concept to completion.
- Maintain rigorous documentation and adhere to industry protocols, ensuring consistent quality and compliance.
- Lead and mentor team members, promoting a results-driven culture of continuous improvement.
Qualifications and Education Requirements
- BS or MS in Physics, Material Science, Electrical Engineering, Mechanical Engineering, Industrial Engineering or related fields with a minimum of 3-5+ years
- Expertise in semiconductor packaging, including wire bonding and epoxy die attach/bonding.
- Experience with specialty equipment qualification and calibration; ability to troubleshoot specialty equipment and custom tooling (in coordination with Equipment Engineering).
- Strong excel and data analysis skills; familiarity with data analysis software packages such as JMP is preferred.
- Knowledge of statistical process control (SPC) and six-sigma practices.
- Experience working hands-on in a cleanroom manufacturing environment.
- Proven ability to work in a team-oriented, fast-paced environment, managing multiple priorities and projects with efficiency and reliability.
- Strong analytical skills, detail-oriented, with a commitment to quality and safety
- Proficiency with Microsoft 365 applications, including Excel, Word, and Outlook.
- Excellent communication and interpersonal skills, with the capability to work collaboratively within cross-functional teams.
- Adaptability and flexibility to changing priorities as required.
- Position requires work on DoD contracts, and therefore qualified applications must be US Person (U.S. citizen or green card holder)
Preferred Skills
- Background in IR FPA Packaging, particularly flip-chip hybridization techniques
- Setting up electronic test equipment and performing device screening
- Knowledge of semiconductor device physics, photodetectors, and FPAs
- Background in semiconductor processing
- Programming experience, Python in particular
Attollo is an equal opportunity employer, including disability and protected veterans. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran.
