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Sr Staff Packaging Engineer

3 months ago

San Jose, United States Empower Semiconductor Full time

Empower Semiconductor is offering an exciting career opportunity for a talented and experienced Packaging Engineer to join our innovative R&D group. Based in San Jose CA, our team of power technology experts is looking for a dynamic individual who shares our passion for pushing the boundaries of semiconductor design and physics.


At Empower Semiconductor, our technology powers the AI revolution by reducing the energy footprint and total cost of ownership of Data Centers. Its transformational Integrated Voltage Regulators deliver on-demand scalable power with the speed, precision, and signal integrity required by AI processors. Empower’s power management architecture shrinks solution footprint, height and component count achieving vertical power delivery with unprecedented power density and efficiency.


Why Empower?

  • Innovation at the core: Work with a team of industry leaders who are dedicated to advancing power technology.
  • Cutting-Edge work: Contribute to Integrated Voltage Regulators (IVR) and ECAP projects and applications that are shaping the future of semiconductor design and power solutions.
  • Career Growth: Thrive in an environment that values professional development and growth.
  • Competitive compensation and benefits package.
  • A supportive and inclusive workplace culture.


Experience, Skills, and Qualifications:

  • Responsibility for defining substrate/package design rules, process flows and material sets for new power module packages
  • Drive alignment between module substrate (PCB) design requirements and supplier capabilities, to enable new product development and volume manufacturing of power modules
  • Develop new assembly technologies, run process DOE’s, define process windows for new package development
  • Drive reliability testing and qualification of new packages in conjunction with the reliability function
  • Work closely with offshore assembly and substrate partners to develop new processes
  • Work closely with IC design teams to define package design rules and define packages to meet their requirements
  • Collaborate with multi-functional teams within Empower Semiconductor for successful development, qualification and production ramp of new module products


Job Requirements:

  • BS Degree in Electrical Engineering, Mechanical Engineering, Material Science.
  • Minimum experience 10 years in semiconductor packaging technology.
  • Experience leading multi-die packages.
  • Understanding of organic laminate technologies manufacturing and supplier capabilities.
  • Experience with package substrate design rules, tools (including AutoCAD)
  • Ability to set-up Design Rule Checks for verification of every aspect of the PCB layout
  • Extensive experience collaborating with OSAT vendors/suppliers
  • Experience in SMT or passive integrated package assembly
  • Experience with packaging processes: Wafer Back-grinding, Wafer Dicing, Die Attach, Wire-bonding, Molding, and Package Singulation. (Flip Chip is a plus)
  • Knowledge of AEQ reliability requirements., APQP automotive development process is a plus
  • Knowledge of JEDEC/IPC design standards is a plus
  • Occasional travel to attend technology reviews and resolve subcon/supplier issues may be required