Substrate Process Engineer

1 month ago

Berkeley, United States Thintronics® Full time

Engineer III, Senior or Lead - Packaging Process Integration


About Thintronics

More Data. Faster.


Global data volume traffic has been growing exponentially. The onset of AI applications is expected to make this worse. New insulator technology that enables higher frequency data transmission at lower power consumption is required to scale AI infrastructure, starting with the data center fabric. By synthesizing expertise in bottom-up Molecular Design, Computational Mechanics, and Electrical Engineering, Thintronics is unifying and optimizing the high-speed interconnect insulator, from silicon-to-system, enabling the highest data rates at the lowest power.


Thintronics is a start-up company located in Berkeley, CA. We are a team of chemists, materials scientists, and engineers shaping the future of data and devices. We offer an exciting start-up environment at the interface of R&D, machine learning-aided product design, manufacturing, and rapid market implementation.


Job Description

We are looking for a talented Packaging Process Integration Engineer to support Thintronics’ adoption into advanced semiconductor applications. This is a high-visibility/high-impact role with leadership growth potential.


The position responsibilities include:

1) NPI and Processing Guidelines Development

· Work with OSAT and substrate manufacturers to develop and refine substrate manufacturing guidelines

· Create DFM/DFA reports (Design for Manufacturability/Assembly)

· Establish Design of Experiments for yield optimization and high-volume manufacturing

· Synthesize experimental data and generate design rules to be shared with design teams

2) Novel Packaging Integration Schemes

· Develop new integration schemes and future product roadmaps that leverage Thintronics’ technology in areas such as 2.5/3D heterogeneous integration, interposer, chiplet, and system-in-package (SiP)

Additional responsibilities may include:

· Support company growth by mentoring junior engineers and scientists

· Build and maintain internal relationships with the R&D team

· Communicate Thintronics’ achievements and product roadmap to a larger audience through Trade Shows and Business Development events


Who We Want

We are seeking entrepreneurial people because here – your impact matters. We want individuals who aren’t afraid of hard work and new challenges; possess a “can-do” attitude; can work independently as well as collaboratively; and have the drive to excel.


Minimum Qualifications:

· M.S. or Ph.D. in Material Science, Mechanical Engineering, Electrical Engineering, or Chemistry with emphasis on packaging or PCB design and manufacturing.

· 5+ years of experience in semiconductor packaging design or manufacturing.

· Strong understanding of substrate quality metrics (processability, reliability, thermo-mechanical performance, cost trade-offs).

· Good grasp of IC packaging value chain and its geography (foundry, substrate manufacturing, OSAT).

· Ability to communicate ideas and provide guidance using CAD tools (ex: AutoCAD, Cadence APD, Xpedition)

· Basic knowledge of SI/PI design trade-offs (IR drop, power delivery networks, channel loss, crosstalk, etc).


Compensation

· Competitive Bay Area salary

· 100% employee coverage for Health/Vision/Dental Insurance

· Unlimited PTO policy +10 Company Holidays

· Equity/Stock Options

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