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Senior Engineer, Advanced Packaging Feasibility Layout Design

3 months ago

San Jose, United States Samsung Semiconductor Full time
  • Senior Engineer, Advanced Packaging Feasibility Layout Design provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.
  • Responsible for the advanced packaging design flow set-up, and design tool bring-up.
  • Design and develop a package and interconnect methods in the areas of SiP/modules, wafer level, and multi-chip module.
  • Bachelors in Electrical Engineering, Mechanical Engineering, Materials Science or Physics with 5+ years of experience or Masters in Electrical Engineering, Mechanical Engineering, Materials Science or Physics with 3+ Years of Industry Experience or PhD in Electrical Engineering, Mechanical Engineering, Materials Science or Physics with 0+ yrs of Industry Experience Preferred.
  • Expert in package design tools: Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP), and/or Siemens Xpedition platform tools (XPD/XSI/XLM).
  • An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.
  • Give Back With a charitable giving match and frequent opportunities to get involved, we take an active role in supporting the community.
  • Care for Family Whatever family means to you, we want to support you along the way—including a stipend for fertility care or adoption, medical travel support, and an errand service.