F9 WLA Process Integration and Yield Engineering Manager
1 month ago
Are you interested in being part of Intel's strategy to advance Moore's law for the next 50 years? Then The New Mexico Disaggregation Manufacturing Organization (NM DMO) is the place for you.
The New Mexico Disaggregation Manufacturing Organization (NM DMO) is in the midst of exciting growth and transformation. As the needs for the worlds compute capabilities have evolved and grown, advanced packaging has become a critical part of the semiconductor industry roadmap. NM DMO brings Advanced Packaging and Foveros HVM (High Volume Manufacturing) to life under a single organization with all segments of the process co-located at a single campus for the first time.
As part of our growth, we are looking for amazing talent with experience in HVM and foundry, and servicing customers both at a local and global level. Join us and help us create the next generation of technologies that will shape the future for decades to come.
As a Process Integration and Yield Engineering Manager, you will manage a team of Wafer Level Assembly (WLA) process integration/yield engineers who drive yield, defect, and quality improvement activities to meet targets. The Process Integration and Yield Engineering Manager is responsible, but not limited to:
Proactively identifying risk and opportunity, based on in depth understanding of process flow, product architecture, process interactions, process equipment and effective research of industry literature.
Overseeing the local change control process and review board.
Leading a team which is capable of effectively triangulating process flow, electrical/test information, and physical FA to form complete physical models and risk assessments across technologies.
Responding urgently to factory excursions, determining root cause, and implementing solutions which address the underlying sources of the problem and proactively applying the solution to other modules.
Oversees excursion management processes and exhibits leadership amidst complex and impactful material review boards.
Working with internal and external customers to identify, assess, and mitigate quality risks.
Understanding new technologies and novel foundry yield characterization techniques as needed.
Generating and driving critical program and technology roadmaps to ensure world class cost and quality products.
Relocation assistance provided.
Bachelor's degree in an Engineering or Physics, Electrical Engineering, or a related field of study with 6+ years of experience.
~ Master's degree in an Engineering or Physics, Electrical Engineering or a related field of study with 4+ years of experience.
~ PhD degree in an Engineering or Physics, Electrical Engineering or a related field of study with 2+ years of experience
~5+ years of Semiconductor fabrication (or packaging) experience.
~2+ years of collaboration experience with defect inspection, failure analysis, integration, and module engineering.
~2+ years of experience with statistical analysis tools such as JMP.2+ years of experience interpreting product data including inline parametrics, defect and SORT data, finding failure root cause and inline indicator and driving for solutions.
Experience in new semiconductor technology development.
~ Experience in data analysis and statistical process control (JMP, SQL, PCS)
~ Fundamental understanding of semiconductor process flow.
~ Demonstrated leadership experience in factory level projects and executing projects in a timely manner.
~ Knowledge on inline inspection method, electrical test structures and SORT programs.
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation.
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