Sr Scientist, Technologist for 3D Integration and Advanced Packaging
1 week ago
Job Title: Technologist, 3D Integration and Advanced Packaging Job Code: 17329 Job Location: Palm Bay, FL Job Schedule: 9/80 (Every other Friday off) Relocation: Relocation assistance is available for qualified candidates Job Description: This is an exciting senior level role responsible for leading 3D semiconductor packaging solutions and heterogeneous integration solutions. Work across the industry to identify partners, tools, and technologies to develop advanced packaging solutions for 3D-ICs, 2.5D, chiplets, silicon interposers, and other applications utilizing high density interconnect such as wafer-to-wafer and die-to-wafer stacking. This key role will provide technical insight for our existing technologies and develop new technologies to capture and lead new programs with our military, government, and commercial customers. Essential Functions: Technical and business leadership focused on developing 3D packaging solutions such as fine pitch electrical interconnects, die-to-wafer, and wafer-to-wafer stacking Establish strategic direction for new processes and integration strategies for design, process, metrology, and IP technology transfers Lead intra and inter technology transfer for advanced packaging including process documentation (i.e. PDKs, tool lists, process or record, etc.) process engineering (i.e. transfer tutorials, training, engineering support, reliability, etc.) and process calibration (test chip design, calibration wafers, etc.) Represent the organization as the prime technical contact on contracts and projects. Interacts with senior external personnel on significant technical matters often requiring coordination between organizations. Own and develop tactical and operational strategies that enable advanced packaging business to scale Develop collaborative relationships with Engineering Managers and Program Leadership to support business demands including bid and proposal Domestic and International Travel Required up to 25% of time Qualifications: Bachelor’s Degree and a minimum of 15 years of prior relevant experience or Graduate Degree and a minimum of 13 years of prior related experience. In lieu of a degree, minimum of 19 years of prior related experience. Ability to obtain a US government Security Clearance at the TS/SCI level 9+ years experience in wafer level packagin from R&D to Development and into Production Prior or current experience with management skills, including demonstrated ability to think end-to-end and manage multiple priorities / projects simultaneously Experience in engineering leadership and business development Experience in BEOL (Back End of Line) processes including ASML i-line photolithography, microbumping, TSV plating, CMP, etc. Preferred Additional Skills: Experience with IP licensing and technology transfer
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Palm Bay, United States L3Harris Technologies Full timeJob Title: Technologist, 3D Integration and Advanced Packaging Please make sure you read the following details carefully before making any applications. Job Code: 17329 Job Location: Palm Bay, FL Job Schedule: 9/80 (Every other Friday off!) Relocation: Relocation assistance is available for qualified candidates Job Description: This is an exciting...
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Palm Bay, FL, United States L3Harris Technologies Full timeJob Title: Technologist, 3D Integration and Advanced PackagingJob Code: 17329Job Location: Palm Bay, FLJob Schedule: 9/80 (Every other Friday off!)Relocation: Relocation assistance is available for qualified candidates Job Description: This is an exciting senior level role responsible for leading 3D semiconductor packaging solutions and heterogeneous...
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Palm Bay, United States L3Harris Technologies Full timeJob Title: Technologist, 3D Semiconductor Integration and Advanced Packaging Engineer Job Code: 16213 Job Location: Palm Bay, FL Job Schedule: 9/80 (Every other Friday off!) Relocation: Relocation assistance is available to qualified applicants Job Description: Responsible for architecting 3D semiconductor packaging solutions and heterogeneous...
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Palm Bay, United States L3Harris Technologies Full timeJob Title: Technologist, 3D Semiconductor Integration and Advanced Packaging Engineer Job Code: 16213 Job Location: Palm Bay, FL Job Schedule: 9/80 (Every other Friday off!) Relocation: Relocation assistance is available to qualified applicants Job Description: Responsible for architecting 3D semiconductor packaging solutions and heterogeneous...
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Palm Bay, United States L3Harris Technologies Full timeJob Title: Technologist, 3D Semiconductor Integration and Advanced Packaging Engineer A high number of candidates may make applications for this position, so make sure to send your CV and application through as soon as possible. Job Code: 16213 Job Location: Palm Bay, FL Job Schedule: 9/80 (Every other Friday off!) Relocation: Relocation assistance is...
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Palm Bay, United States L3Harris Technologies Full timeJob Title: Technologist, 3D Semiconductor Integration and Advanced Packaging EngineerJob Code: 16213Job Location: Palm Bay, FLJob Schedule: 9/80 (Every other Friday off!)Relocation: Relocation assistance is available to qualified applicants Job Description: Responsible for architecting 3D semiconductor packaging solutions and heterogeneous integration...
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Palm Bay, FL, United States L3Harris Technologies Full timeJob Title: Technologist, 3D Semiconductor Integration and Advanced Packaging EngineerJob Code: 16213Job Location: Palm Bay, FLJob Schedule: 9/80 (Every other Friday off!)Relocation: Relocation assistance is available to qualified applicants Job Description: Responsible for architecting 3D semiconductor packaging solutions and heterogeneous integration...
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Indialantic, FL, United States L3Harris Technologies Full timeJob Title: Technologist, 3D Semiconductor Integration and Advanced Packaging Engineer Job Code: 16213 Job Location: Palm Bay, FL Job Schedule: 9/80 (Every other Friday off!) Relocation: Relocation assistance is available to qualified applicants Job Description: Responsible for architecting 3D semiconductor packaging solutions and heterogeneous...
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3D Semiconductor Packaging Solutions Architect
2 weeks ago
Palm Bay, Florida, United States L3Harris Technologies Full timeJob Title: Technologist, 3D Semiconductor Integration and Advanced PackagingA key role is available for a technologist to architect 3D semiconductor packaging solutions and heterogeneous integration processes. The ideal candidate will work across the industry to identify partners, tools, and technologies to develop advanced packaging solutions for 3D-ICs,...
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Palm Bay, Florida, United States L3Harris Technologies Full timeJob Title: Technologist, 3D Integration and Advanced PackagingJob Code: 17329Job Schedule: 9/80 (Every other Friday off)Relocation: Relocation assistance is available for qualified candidatesJob Description: This is an exciting senior-level role responsible for leading 3D semiconductor packaging solutions and heterogeneous integration solutions. Work across...
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Process Integration Engineer, Advanced Packaging
31 minutes ago
Palm Bay, FL, United States L3Harris Technologies Full timeJob Title: Process Integration Engineer, Advanced Packaging (1st Shift) (Palm Bay, FL) Job Code: 16915 Job Location: Palm Bay, FL Job Description: L3Harris Technologies is seeking a highly motivated Advanced Packaging Process Integration Engineer to join the Microelectronics Division at Palm Bay, FL location. As a member of our dynamic and...
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Yield Engineer, Advanced Packaging
3 weeks ago
Palm Bay, United States L3Harris Technologies Full timeJob Title: Yield Engineer, Advanced Packaging Job Code: 16920 Job Location: Palm Bay, FL Job Description: L3Harris Technologies is seeking a highly motivated Advanced Packaging Yield Engineer to join the Microelectronics Division at Palm Bay, FL location. As a member of our dynamic and collaborative environment, you will be responsible for...
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Process Integration Engineer, Advanced Packaging
31 minutes ago
Palm Bay, FL, United States L3Harris Technologies Full timeJob Title: Process Integration Engineer, Advanced Packaging (1st Shift) (Palm Bay, FL) Job Code: 16915 Job Location: Palm Bay, FL Job Description: L3Harris Technologies is seeking a highly motivated Advanced Packaging Process Integration Engineer to join the Microelectronics Division at Palm Bay, FL location. As a member of our dynamic and...
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Yield Engineer, Advanced Packaging
12 hours ago
Palm Bay, United States L3Harris Technologies Full timeJob Title: Yield Engineer, Advanced Packaging A high number of candidates may make applications for this position, so make sure to send your CV and application through as soon as possible. Job Code: 16920 Job Location: Palm Bay, FL Job Description: L3Harris Technologies is seeking a highly motivated Advanced Packaging Yield Engineer to join the...
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Advanced Packaging Yield Engineer
6 days ago
Palm Bay, Florida, United States L3Harris Technologies Full timeJob Title: Advanced Packaging Yield EngineerJob Code: 16920Job Location: Palm Bay, FLJob Description:L3Harris Technologies is seeking a highly motivated Advanced Packaging Yield Engineer to join the Microelectronics Division at Palm Bay, FL location. As a member of our dynamic and collaborative environment, you will be responsible for developing...
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Advanced Packaging Process Integration Engineer
2 weeks ago
Palm Bay, Florida, United States L3Harris Technologies Full timeJob Title: Advanced Packaging Process Integration EngineerWe are seeking a highly motivated Advanced Packaging Process Integration Engineer to join our team at L3Harris Technologies. As a member of our dynamic and collaborative environment, you will be responsible for developing and integrating semiconductor processes to support the production of advanced...
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Palm Bay, United States L3Harris Technologies Full timeJob Title: Process Integration Engineer, Advanced Packaging (1st Shift) (Palm Bay, FL) Job Code: 16915 Job Location: Palm Bay, FL Job Description: L3Harris Technologies is seeking a highly motivated Advanced Packaging Process Integration Engineer to join the Microelectronics Division at Palm Bay, FL location. As a member of our dynamic and...
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Process Integration Engineer, Advanced Packaging
3 weeks ago
Palm Bay, United States L3Harris Technologies Full timeJob Title: Process Integration Engineer, Advanced Packaging (1st Shift) (Palm Bay, FL) Job Code: 16915 Job Location: Palm Bay, FL Job Description: L3Harris Technologies is seeking a highly motivated Advanced Packaging Process Integration Engineer to join the Microelectronics Division at Palm Bay, FL location. As a member of our dynamic and...
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Palm Bay, United States L3 Technologies Full timeJob Title: Process Integration Engineer, Advanced Packaging (1st Shift) (Palm Bay, FL)Job Code: 16915Job Location: Palm Bay, FLJob Description:L3Harris Technologies is seeking a highly motivated Advanced Packaging Process Integration Engineer to join the Microelectronics Division at Palm Bay, FL location. As a member of our dynamic and collaborative...
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Sr. Semiconductor Advanced Packaging Designer
3 weeks ago
Palm Bay, United States L3Harris Technologies Full timeJob Title: Sr. Semiconductor Advanced Packaging Designer (Cadence Allegro) Job Code: 16822 Job Location: Palm Bay, FL Job Schedule: 9/80 (Every other Friday off!) Relocation: Relocation assistance may be provided for qualified applicants Job Description: This role will require you to design complex die level component packages requiring knowledge...
