Jobs for packaging engineer at Phoenix

Top Mandatory Skills:7+ years of advanced semiconductor packaging experience.Hands-on experience with 2.5D & 3D packaging technologies.Strong experience with chiplet architectures and heterogeneous integration.Experience with multi-die package design, silicon interposers, TSV, and advanced substrate technologies.Experience supporting AI/HPC semiconductor...

The Packaging Engineer designs, develops, and implements innovative packaging solutions that protect products, optimize manufacturing efficiency, and meet customer requirements from concept through production. We're looking for someone who Holds a bachelor’s degree in Packaging Engineering, Mechanical Engineering, Materials Science, or a related field...

## Packaging Module EngineerApplylocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Todayjob requisition id: JR0284787# **Job Details:**## Job Description:The Role and ImpactAs a **Packaging Module Engineer**, you will play a pivotal role in shaping Intel's advanced packaging solutions that directly impact the delivery, performance,...

Position Title: Packaging Development Engineer Location: Remote (Candidates must be based in AZ, CA, MD, IL, or GA) Classification: Exempt (Salaried) Work Schedules: Full-Time; Requires frequent travel to manufacturing sites in AZ and MD. Summary This role is with a premier specialty contract packaging (co-packer) and OEM food manufacturer recognized for...

Job Description The Role and Impact As a Packaging Module Engineer, you will play a pivotal role in shaping Intel’s advanced packaging solutions that directly impact the delivery, performance, and sustainability of cutting-edge products. By applying scientific and engineering principles, you will design and develop innovative packaging solutions that...

Accroid Inc. is seeking a senior packaging engineer with deep expertise in advanced semiconductor packaging. You will lead design efforts for 2.5D/3D systems, chiplet architectures, and heterogeneous integration, collaborating with OSATs and foundries through concept to production.Candidates should command thermal, mechanical, and electrical package design,...

Intel Corporation in Phoenix is seeking a Packaging Module Engineer to design and qualify advanced packaging solutions that safely transport and optimize performance of Intel products. You will lead development programs across prototypes, testing, and documentation, ensuring compliance with internal standards.You will collaborate with manufacturing,...

Job Details This role will support root cause determination of assembled package yield loss and in-line failures on a back of week compressed shift. The engineer on shift will be responsible for technical functions such as design, test, checkout, modifications, and characterization of assembly technologies. Engineers on back/front of week shift schedules...

Intel is seeking a Mechanical Engineer for the Advanced Packaging Mechanical Analysis team in Chandler, AZ. This position focuses on developing advanced finite element analysis simulations for semiconductor packaging, requiring regular onsite presence.The ideal candidate will possess a PhD in Mechanical Engineering and relevant experience in...

## Package Failure Analysis EngineerApplylocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Todayjob requisition id: JR0285288# **Job Details:**## Job Description:This role will support root cause determination of assembled package yield loss and in-line failures on a back of week compressed shift. The engineer on shift will be...

Intel is seeking a Packaging Quality and Reliability Engineer to drive quality standards for packaging components across development and manufacturing. You will shape reliability models, analyze failure data, and influence decisions that ensure product readiness.You will collaborate with internal teams and external partners to meet milestones, define...

OverviewIntel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you\'ll have the opportunity to use technology to power major breakthroughs and create enhancements that...

SlingShot Connections seeks a Packaging Engineer to design and implement packaging solutions from concept to production. You will use CAD tools to create robust packaging, validate designs through testing, and collaborate with cross-functional teams to ensure cost-effectiveness and manufacturability.The ideal candidate has 3+ years in packaging engineering,...

Intel’s Stress Testing and Reliability Laboratory seeks an experienced engineer to join the Environmental Stress Tool Engineering team in Arizona. You will advance packaging technologies (EMIB, Foveros, Hybrid Bonding, Co‑Packaged Optics) and support qualification and development efforts, operating advanced stress systems to produce reliable data for...

Intel Corporation is seeking a Mechanical Design Engineer focused on semiconductor packaging. You will design Tape and Reel packaging, create and maintain mechanical layouts for substrates, IHS, stiffeners and assemblies, and develop trays used in assembly.You will work with architecture, process and assembly teams to ensure design intent and...

Job Details The Stress Testing and Reliability Laboratory is seeking a motivated, hands‑on engineer to join our Environmental Stress Tool Engineering team. In this role, you will play a key part in advancing Intel's next‑generation packaging technologies, including EMIB, Foveros, Hybrid Bonding, and Co‑Packaged Optics, while supporting package...

Intel in the United States (Arizona, Phoenix) seeks a Packaging Module Engineer to shape advanced packaging solutions impacting product delivery, performance, and sustainability. You will design packaging that ensures secure transport and optimal performance globally, collaborating with industry-leading teams.The role encompasses development processes,...

## Advanced Packaging Reliability Lab EngineerApplylocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Todayjob requisition id: JR0285579# **Job Details:**## Job Description:The Stress Testing and Reliability Laboratory is seeking a motivated, hands-on engineer to join our Environmental Stress Tool Engineering team. In this role, you...

# **Job Details:** ## Job Description: Join Intel's Advanced Packaging Technology Development team as a Packaging Module Development Engineer. In this pivotal role you will develop and optimize cutting-edge substrate processes and equipment to enable Intel's future packaging platform technologies. Your contributions will directly impact the...

Intel Corporation in Phoenix, AZ is seeking a Process Development Engineer for night shift support of advanced packaging fabrication. You will collaborate with cross-functional teams to qualify new materials and processes, perform MBPS and data-driven analyses, and support 24/7 operations on the pilot line.The role emphasizes problem-solving,...