osat

Tenstorrent, based in Santa Clara, CA, is seeking a Global Supply Chain Manager to own OSAT partnerships, backend manufacturing execution, and supply continuity from wafer-out to final shipment. The role requires 7+ years in semiconductor supply chain and experience with OSAT workflows and ERP/PLM tools. Hybrid travel to Asia-Pacific regions is expected. The...

WHAT YOU DO AT AMD CHANGES EVERYTHINGAt AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create...

Global Supply ManagerSnap Inc is a technology company. We believe the camera presents the greatest opportunity to improve the way people live and communicate. Snap contributes to human progress by empowering people to express themselves, live in the moment, learn about the world, and have fun together.The Company operates Snapchat, a visual messaging app...

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high...

Tenstorrent is seeking a Global Supply Chain Manager to own OSAT partnerships, backend manufacturing execution, and supply continuity from wafer-out through final shipment. Role welcomes candidates across North America and Asia-Pacific time zones with ~25–30% travel and hubs in Santa Clara, Austin, or Toronto. We value data-driven operators experienced...

Tenstorrent is seeking a Global Supply Chain Manager to own OSAT partnerships, backend manufacturing execution, and supply continuity from wafer-out through final shipment. Role welcomes candidates across North America and Asia-Pacific time zones with ~25–30% travel and hubs in Santa Clara, Austin, or Toronto. We value data-driven operators experienced...

Job Title Pay Range: $52.70hr - $57.70hr Requirement/Must Have Education: Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related technical field. Experience: 5+ years in semiconductor supply chain R&D, component/product engineering, or hardware/reliability engineering, with at least 2 years of direct exposure to power...

Amazon Leo is Amazon’s low Earth orbit satellite broadband network. Its mission is to deliver fast, reliable internet to customers and communities around the world, and we’ve designed the system with the capacity, flexibility, and performance to serve a wide range of customers, from individual households to schools, hospitals, businesses, government...

The Sr. Director, Technical ProgramManagementwill lead a global technical program management organization responsible for driving execution of strategic AI/Datacenter Infrastructure Power package engineering and new product introduction (NPI) programs. This leader will partner closely with Package Engineering Directors,Power product group...

About GlobalFoundries:GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that...

Hi, Hope you are doing well. Please find the job description below and let me know your interest. Position: Director/Manager of Manufacturing Operations -Supply Chain Location: Hybrid in San Jose, CA or Dallas, TX Duration: 6 to 12+ months Mode of Interview: Video Summary We is seeking a Director/Manager of Manufacturing Operations to lead our...

Staff Packaging EngineerAbout UsAdeia Inc. (Nasdaq: ADEA) develops foundational innovations that shape how the world computes, connects and experiences entertainment. Its inventions span a broad range of semiconductor and media technologies, including 3D interconnect (hybrid bonding) and advanced thermal management for AI datacenters, as well as content...

Leo is Amazon’s low Earth orbit satellite broadband network. Its mission is to deliver fast, reliable internet to customers and communities around the world, and we’ve designed the system with the capacity, flexibility, and performance to serve a wide range of customers, from individual households to schools, hospitals, businesses, government agencies,...

Leo is Amazon’s low Earth orbit satellite broadband network. Its mission is to deliver fast, reliable internet to customers and communities around the world, and we’ve designed the system with the capacity, flexibility, and performance to serve a wide range of customers, from individual households to schools, hospitals, businesses, government agencies,...

Our vision is to transform how the world uses information to enrich life for all.Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.The Global Design, Simulation, and Substrate team at Micron...

Job Description Responsibilities: Package Technology Development/NPI, R&D, Global OSAT management for new Package Development/Product qualification, Technology Roadmap definition, R&D budget management & customer adoption programs. Focus on design and development of package and interconnect methods for Renesas’s AI/Datacenter Infrastructure Power...

Job Details: Job Description:Intel Corporation is one of the world's leading semiconductor companies, driving innovation across computing, connectivity, and artificial intelligence. With a bold vision to shape the future of technology, Intel is transforming how the world processes, stores, and communicates data. Our Advanced Packaging ,Test and Manufacturing...

Senior Director Package & Assembly EngineeringFull-timeEmployment Type: Regular (PERM)Remote Work Available: NoThe Sr. Director, will lead organization responsible for driving execution of packaging development, new product introduction and assembly engineering continuous improvement. This leader will partner closely with Package Design and Development...

Intel Corporation in Oregon, Hillsboro, is seeking a Sort Interface Pathfinding and Development Engineer to pioneer probing and test solutions for die and wafer sort across advanced packaging platforms. Lead DOE efforts, liaison with Foundry/OSAT customers, and develop interface rules and kits for ecosystem integration.You will collaborate with global...

Job Details:Job Description:Intel Corporation is one of the world's leading semiconductor companies, driving innovation across computing, connectivity, and artificial intelligence. With a bold vision to shape the future of technology, Intel is transforming how the world processes, stores, and communicates data. Our Advanced Packaging ,Test and Manufacturing...