ibi inc

Advanced Micro Devices, Inc. (AMD) in Santa Clara, CA seeks a Sr. Signal Integrity/Power Integrity Engineer to ensure next‑generation products meet reliability, performance and efficiency goals.You will design, analyze, model and validate high‑speed channels and power delivery across complex boards and systems. You will collaborate with silicon IP, ASIC...

CompanyQualcomm Technologies, Inc.Job AreaEngineering Group, Engineering Group > Packaging EngineeringGeneral SummaryThe candidate will work in a collaborative engineering environment, performing signal and power integrity tasks while partnering with package, platform and IC designers to optimize package and system designs. Primary responsibilities include...

Oracle Fusion SaaS - Finance Techno-Functional ConsultantLocation: 100% REMOTE Length: 12 months Start: ASAP Interview: Video Functional/Technical Knowledge & Skills: Must have experience of the following SAAS Financials 12.1.3 capabilities: We expect candidate to have: Strong Financials business processes knowledge and concepts. Implementation/Support...

CompanyQualcomm Technologies, Inc.Job AreaEngineering Group, Engineering Group > Packaging EngineeringGeneral SummaryThe candidate will work in a collaborative engineering environment, performing signal and power integrity tasks while partnering with package, platform and IC designers to optimize package and system designs. Primary responsibilities include...

Company Qualcomm Technologies, Inc. Job Area Engineering Group, Engineering Group > Packaging Engineering General Summary The Qualcomm Central Hardware Systems (CHS) team is seeking a Senior Leader, Electrical Systems Architect to define, develop, and productize next-generation high-speed electrical interconnect technologies for AI, hyperscale datacenter,...

Micron Technology, Inc. in Boise seeks a Principal Signal Integrity Engineer to lead development and analysis of high-speed memory interfaces and PDN, applying AI/ML to accelerate SI/PI analyses and optimization.You will collaborate with package, silicon, system engineering, product and marketing teams to ensure performance and help drive future standards...

Job DescriptionJob Description About the Company:At SK Hynix Memory Solution, we're at the forefront of semiconductor innovation, developing advanced memory solutions that power everything from smartphones to data centers. As a global leader in DRAM and NAND flash technologies, we drive the evolution of advancing mobile technology, empowering cloud...

Company Qualcomm Technologies, Inc. Job Area Engineering Group, Engineering Group > Packaging Engineering General Summary Qualcomm Central Hardware Systems (CHS) team is seeking a Senior Leader, Electrical Systems Architect to define, develop, and productize next-generation high-speed electrical interconnect technologies for AI, hyperscale datacenter,...

Database Administrator – Advanced (DB2 z/OS)Title: Database Administrator – Advanced (DB2 z/OS)Seeking an experienced Database Administrator to manage, optimize, and support DB2 for z/OS, SQL Server, Oracle, and GIS databases while ensuring performance, reliability, and compliance with department security standards.Responsibilities:Administer, design,...

Job Description The Future Talent Program within the Data, AI, and Genome Sciences (DAGS) Department is offering co-op opportunities that last a period of six months. There is one position in the Patient Data Learning group. Candidates can apply for the opportunity to be involved in a computational project designed to enable students to further develop...

Job Description The Future Talent Program within the Data, AI, and Genome Sciences (DAGS) Department is offering co-op opportunities that last a period of six months. There is one position in the Patient Data Learning group. Candidates can apply for the opportunity to be involved in a computational project designed to enable students to further develop...

Forming Our Future together FormFactor, Inc. (NASDAQ: FORM), is a leading provider of essential test and measurement technologies along the full semiconductor product life cycle — from characterization, modeling, reliability, and design de-bug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to...

Business Intelligence & Informatics Consultant Services, Inc. (BIICS, Inc) | Contract Business Intelligence & Informatics Consulting Services, Inc.(BIICS, Inc) is a business and information management solutions company servingclients in both the public and private sector. With access to newopportunities every day, BIICS, Inc is a premier source for placing...

Company:Qualcomm Technologies, Inc.Job Area:Engineering Group, Engineering Group > Packaging EngineeringGeneral Summary:As a Qualcomm Package System Design and Technology Engineer, you will drive new advanced package technology development, concept design architecture analysis from package to system, new generation product package structure selection,...

Customer Service RepHutchinson, Minnesota, IBIS Pizza, LLCAbout Uslocally owned and operatedJob DescriptionTaking orders over the phone and in store helping customers with transactionsQualificationsno qualifications need all training is providedAdditional InformationAll your information will be kept confidential according to EEO guidelines.This job posting...

Family EducatorTampa, FL 33605## OverviewSalary Range$46,500.00 - $47,697.00 Salary/yearPosition TypeFull Time## Description**PROGRAM/DEPARTMENT:** Family Learning Center (FLC) **TITLE:**Family Educator **CLASSIFICATION:** Full-Time (37.50 hours per week), Exempt, Salary: $46,500 - $47,697 / year**Position Summary:**This is a professional family educator...

Description About the Role We are looking for a Senior Manager of Package Signal & Power Integrity to lead a small team of engineers delivering SI/PI solutions for next-generation 2.5D/3D chiplet-based products. This is a player-coach role: you will set the technical direction for package-level SI/PI across advanced packaging platforms (CoWoS, EMIB, 3D die...

Description About the Role We are looking for a Senior Manager of Package Signal & Power Integrity to lead a small team of engineers delivering SI/PI solutions for next-generation 2.5D/3D chiplet-based products. This is a player-coach role: you will set the technical direction for package-level SI/PI across advanced packaging platforms (CoWoS, EMIB, 3D die...

Company Qualcomm Technologies, Inc. Job Area Engineering Group, Engineering Group > Systems Engineering General Summary The Qualcomm Data Center team is developing high-performance, energy-efficient server solutions for data center applications. We are looking for highly talented, innovative, and collaborative individuals to join our advanced platform...

Company Qualcomm Technologies, Inc. Job Area Engineering Group, Engineering Group > Systems Engineering General Summary The Qualcomm Data Center team is developing high-performance, energy-efficient server solutions for data center applications. We are looking for highly talented, innovative, and collaborative individuals to join our advanced platform...