Field Service Engineers/Wire bonding

2 weeks ago

Beaverton, United States KPG99 INC Full time

Hi,

Hope you are doing well.

Please find the job description below and let me know your interest.

Position: Field Service Engineers

Location: Beaverton, OR 97006, Rio Rancho, NM 87124

Duration: Full Time

Mode of Interview: Phone and Video

Job Description:

nterview Process: 2 interviews

*Purely salaried + annual bonus

10% on a not great year; good year (like last year) 20-25%

*Compressed work week; must be flexible 3-4 day work shifts (Oregon; 4 groups of 4 working these types of shifts)

-If they say no to night shifts, they will be disqualified

-No job hoppers, even if they have short-term contracts.

What they are doing:

· New products going into Intel (firebird TCB FLI Bonding)

· Installing and ramping them currently

· Tool install, root cause analysis, maintenance, troubleshooting, diagnostic…

Technology/products:

· Interconnect Technology

· IC assembly (interconnect) when you take a dye from a wafer that was fabricated in the wafer fab and singulate it – die bond it within a package (there are various ways to do that) WIRE BOND or FLIP CHIP BOND

· *Multiple forms of die bonding

What he’s looking for:

· They have doubled in size in the last year and a half – 7 engineers to 27 engineers…he needs 14-15 more…

· Mostly field service engineers; few field application engineers

· Open to new college grads (must present well and have technical aptitude)

o Do they have technical hobbies? What do they do in their spare time?

o Electromechanical appliances or technologies

· A lot of FSE’s come from the wafer fab but those are FRONT-END…these are chip to wafer bonding – it’s different but this is still helpful (chip and die – bonding it to a wafer that gets simulated into an IC package). It does help that they don’t have to teach them about wafer fabs…

Logistics:

· They have one tool being used as a training site/facility – they will be putting more in there for low level development work/process development

o If they aren’t traveling, they will work onsite in Beaverton, Oregon.

· Mexico – no plans of establishing an office/site

· 50% travel – not much travel, mostly onsite at the local Intel sites…(they say 50% to cover themselves but this isn’t realistic):

o 1 Group US Mexico and Canada

o 2 Group (his team): assignment to key account which is Intel. Limited to Intel sites in Costa Rica and North America (AZ, OR, and NM). They have a team dedicated to Costa Rica, so this person won’t need to go there. Talks about going to Ireland…Arizona is winding down…focus is Oregon and NM

· Going onsite to Intel every day

· Rental cars, hotels, per diem…

· Relocation, yes

· Room for growth: yes 1-4 levels, application roles, sales roles, etc.

Key words/phrases to look for:

*DIE INTERCONNECT

*LASER DICING OR LASER GROOVING (Competitor: Disco)

*THERMO COMPRESSION BONDING

*HYBRID BONDING

*FLIP CHIP BONDING

*WIRE BONDING

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