Field Service Engineers/Wire bonding
3 weeks ago
Hi,
Hope you are doing well.
Please find the job description below and let me know your interest.
Position: Field Service Engineers
Location: Beaverton, OR 97006, Rio Rancho, NM 87124
Duration: Full Time
Mode of Interview: Phone and Video
Job Description:
nterview Process: 2 interviews
*Purely salaried + annual bonus
10% on a not great year; good year (like last year) 20-25%
*Compressed work week; must be flexible 3-4 day work shifts (Oregon; 4 groups of 4 working these types of shifts)
-If they say no to night shifts, they will be disqualified
-No job hoppers, even if they have short-term contracts.
What they are doing:
New products going into Intel (firebird TCB FLI Bonding)
Installing and ramping them currently
Tool install, root cause analysis, maintenance, troubleshooting, diagnostic
Technology/products:
Interconnect Technology
IC assembly (interconnect) when you take a dye from a wafer that was fabricated in the wafer fab and singulate it die bond it within a package (there are various ways to do that) WIRE BOND or FLIP CHIP BOND
*Multiple forms of die bonding
What hes looking for:
They have doubled in size in the last year and a half 7 engineers to 27 engineershe needs 14-15 more
Mostly field service engineers; few field application engineers
Open to new college grads (must present well and have technical aptitude)
o Do they have technical hobbies? What do they do in their spare time?
o Electromechanical appliances or technologies
A lot of FSEs come from the wafer fab but those are FRONT-ENDthese are chip to wafer bonding its different but this is still helpful (chip and die bonding it to a wafer that gets simulated into an IC package). It does help that they dont have to teach them about wafer fabs
Logistics:
They have one tool being used as a training site/facility they will be putting more in there for low level development work/process development
o If they arent traveling, they will work onsite in Beaverton, Oregon.
Mexico no plans of establishing an office/site
50% travel not much travel, mostly onsite at the local Intel sites(they say 50% to cover themselves but this isnt realistic):
o 1 Group US Mexico and Canada
o 2 Group (his team): assignment to key account which is Intel. Limited to Intel sites in Costa Rica and North America (AZ, OR, and NM). They have a team dedicated to Costa Rica, so this person wont need to go there. Talks about going to IrelandArizona is winding downfocus is Oregon and NM
Going onsite to Intel every day
Rental cars, hotels, per diem
Relocation, yes
Room for growth: yes 1-4 levels, application roles, sales roles, etc.
Key words/phrases to look for:
*DIE INTERCONNECT
*LASER DICING OR LASER GROOVING (Competitor: Disco)
*THERMO COMPRESSION BONDING
*HYBRID BONDING
*FLIP CHIP BONDING
*WIRE BONDING
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