Nanofabrication Engineer

Nanofabrication research engineer to research and contribute to the design, fabrication, synthesis, characterization, packaging, and testing of nano-fabricated devices and structures for projects such as DNA data storage, quantum sensing and computing, and microelectronics. This may also include delivery of prototype devices. This position involves close collaboration with a highly technical team of research leaders to accomplish task and program objectives, contribute technically to proposal ideation, and conceive and execute internal research efforts refining core fabrication processes and capabilities. Fabrication responsibilities range from process design and supervision to full clean-room implementation, and will utilize a wide range of bulk and micro/nano synthesis/fabrication tools and develop novel techniques to create novel materials, devices, and structures with new properties.

Key Responsibilities

Perform basic tests, experiments, calculations, and/or simulations to determine physical parameters/properties and behaviors of materials and systems and conduct basic data analysis on the results of measurements and/or simulations Perform literature surveys on research topics Generate documentation of experiments and results

Additional Responsibilities

Perform thin film deposition of advanced engineered materials. Growth/deposition of inorganic/organic thin film materials by various PVD/CVD and other techniques Analyze and characterize various materials and devices for aerospace and national security applications. Work with common electronic packaging equipment such as: lithography, etching, dicing saws, wire bonders, etc. Learn & practice advanced packaging techniques to manage RF and thermal challenges with devices and integrated circuits Model and simulate optical & RF devices, and structures Assist in other activities as directed.

Required Minimum Qualifications

Candidates currently enrolled in an accredited degree program relevant to this position will be considered. The candidate must have a graduation date of no later than December 2024 B.S. degree in materials science & engineering, electrical engineering, physics, applied physics, microelectronics, mechanical engineering, or similar field Hands on experience with mechanical, diffusion, cryo- and turbo-pumped vacuum systems, and chillers Hands-on experience with the techniques/equipment for the deposition/growth of thin film materials, such as DC/RF sputtering, thermal and e-beam evaporation, molecular beam epitaxy, and atomic layer deposition equipment. Extensive laboratory and computer skills as demonstrated in independent undergrad projects, master’s thesis research, laboratory internships, etc. Strong coursework foundation in physics and chemistry Strong programming skills in common software / simulation tools such as Python, Matlab etc. Knowledge of semiconductor fabrication techniques or device physics Conversant with material and device characterization techniques/equipment/metrology (such as optical/electron microscopy, electrical/optical parameters analysis, physical morphology) Strong sense of curiosity in both the technical and non-technical aspects of working in applied research.

Preferred Qualifications

Active Secret Clearance Experience with radio frequency component and system simulation and layout software such as HFSS, Cadence AWR, Keysight ADS, Silvaco TCAD, Altium Designer, or Klayout. Characterization and test of bare die in a probe station, load-pull measurements Ability to clearly communicate technical ideas to a non-technical audience

Travel Requirements

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