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Sr. Principal Packaging Engineer

3 months ago

Irvine, United States Skyworks Full time

If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time .

At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We value open communication, mutual trust, and respect. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.

Job Description

Skyworks Solutions is looking for a candidate who possesses expert level, hands-on process expertise in PCB electroless plating to lead our development efforts in this area. In this role, the candidate will also supply senior level packaging leadership, interfacing across multiple corporate and customer-facing functions. Electroless plating enables novel package technologies that are the foundation for Skyworks 3D integrated package product portfolio. The candidate will lead PCB electroless plating process development and support production ramp/clean launch and quality improvement for both internal factory in Baja California and external contractors. To achieve these goals, the successful candidate will work cross functionally with internal Factory, Reliability, Product/Test Engineering, Customer Quality Engineering teams, as well material & equipment suppliers. Candidate will be responsible for driving resolution of Quality Excursions and Continuous improvement in Quality & Manufacturing Efficiency. 

Roles & Responsibilities

Lead technology development and qualification of ENIG-on-PCB surface finish plating process. Lead setup of an electroless plating process line for ENIG-on-PCB surface in both Skyworks internal factory in Baja California and oversee OSAT process quality. Establish and own process quality control methodology. Optimize plating stack-up to improve Second Level SMT reliability. Optimize process to ensure ATE compatibility & quality. Drive continuous improvement in Quality & Manufacturing Efficiency. Benchmark and drive implementation of technology roadmap. Mentor production plating engineers and technicians.  Report to Senior Director of Global Packaging Technology Development. Required to travel and be onsite in Baja Mexico > 50% during first year of process installation and ramp.

Qualifications

Must be hands-on process expert for electroless plating on printed circuit boards. Adept at leading changes to chemistry, process parameters, and daily line quality maintenance. Direct expert in production process control methodologies specifically for large scale electroless PCB plating. Deep understanding on failure mode of PCB surface finish and Second Level solder joint. Familiar with analytical techniques for electroless bath control and maintenance. Familiar with statistical analysis, SPC, FMEA, and problem-solving techniques. Excellent leadership and verbal and written communication skills. Expert level understanding of PCB level failure analysis techniques.

Education Requirements
Bachelor, Master or PhD degree in Materials Science, Chemical Engineering, Physics, or related field with 10+ years of experience in PCB electroless plating process and 15+years of microelectronics industry (12+ years with Master, 8+ years with PhD).