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Electronic-Photonic Process Design Kit

2 months ago

Lexington, United States MIT Lincoln Laboratory Full time

 

MIT Lincoln Laboratory’s Advanced Technology Division develops advanced materials, devices, and subsystems that have broad impact on U.S. Government, industry, and academia. The Division has made a wide range of important contributions during the Laboratory’s 70+ year history, including development of bulk and epitaxial crystal growth, charge-coupled device (CCD) imagers, 193-nm lithography, fully depleted silicon-on-insulator (FDSOI) CMOS electronics, semiconductor diode lasers and amplifiers, superconducting electronics and quantum bit (qubit) devices, and photonic integrated circuits (PICs). To enable this advanced technology development, the Laboratory has implemented vertically integrated in-house resources to facilitate design, lithographic mask layout, material growth and characterization, fabrication (e.g., silicon, compound-semiconductor, wafer bonding, flip-chip hybrid), packaging, and testing of electronic and photonic circuits. These in-house resources are used to fabricate a variety of devices and circuits including lasers, waveguide photodetectors, optical modulators, and CMOS and cryogenic electronics with applications in quantum computing, atomic systems, advanced laser sources, microwave photonics, communications, sensing, and other areas of interest to the U.S. Government, industry, and academia. In-house fabrication resources include:
• Microelectronics Laboratory (ML): Cleanroom housing a silicon-fabrication toolset operating on 200-mm-diameter wafers at a 90-nm lithography node, which represents the most advanced silicon fab in the U.S. Government lab system.
• Compound Semiconductor Laboratory (CSL): Facilities housing III-V and non-silicon material growth (molecular beam epitaxy (MBE), metalorganic chemical vapor deposition (MOCVD), diamond chemical vapor deposition (CVD)) and fabrication
• Microsystems Integration Facility (MIF): Packaging and integration facilities for wire-bonding, vacuum-reflow soldering, flip-chip hybrid integration

 

Job Description


The candidate will work as a member of a multi-disciplinary team responsible for implementing, applying, maintaining, and maturing process design kits (PDKs) for silicon-based, compound-semiconductor, and heterogeneous/hybrid fabrication processes, especially those for photonic integrated circuits (PICs). The candidate may also work on PDKs for superconducting qubit and trapped-ion qubit quantum computing, radiation-hard CMOS, and other emerging integrated circuit technologies. The engineer will work in the Cadence environment, with which they should be fluent. Key development tasks include the creation of technology files, coding parameterized cell libraries, documenting code and methodology updates, and documenting layout changes. The engineer will collaborate with others involved in mask layout from basic layout cell creation and floor-planning to final tapeout. Creation of DRC and LVS decks as these technologies mature will likely be required. Note that many of these technology areas are cutting edge and processes and PDKs will be continuously and rapidly evolving.

 

Required Qualifications


• There is no degree requirement for this position
• Five or more years’ experience with developing technology files and design environments in Cadence or similar tools
• Five or more years’ experience with coding parameterized layout cells, ideally in the Cadence Virtuoso (SKILL) environment
• Experience working on multiple inter-related PDKs and layouts
• Ability to work independently with minimal supervision and collaboratively as part of a dynamic, multi-disciplinary team
• Excellent organization and communication skills both within and across disciplinary boundaries
 


Preferred Qualifications:
• Bachelor’s or Master’s degree in electrical engineering, computer science, materials science, physics, chemistry, or a related field
• Experience with photonic integrated circuit PDK development or mask layout a major plus
• Experience with mask floor-planning, creating custom layout blocks, and mask aggregation
• Experience with LVS beyond traditional CMOS technologies
• Experience with or knowledge of one or more of the following areas:
o The Advanced-Node version of Cadence
o Programming in Perl, TCL, or Python
o RF layout design experience
o Experience with Cadence CurvyCore

 

 

At MIT Lincoln Laboratory, our exceptional career opportunities include many outstanding benefits to help you stay healthy, feel supported, and enjoy a fulfilling work-life balance. Benefits offered to employees include: 

  • Comprehensive health, dental, and vision plans
  • MIT-funded pension
  • Matching 401K
  • Paid leave (including vacation, sick, parental, military, etc.)
  • Tuition reimbursement and continuing education programs
  • Mentorship programs
  • A range of work-life balance options
  • ... and much more  

Please visit our Benefits page for more information. As an employee of MIT, you can also take advantage of other voluntary benefits, discounts and perks.

Selected candidate will be subject to a pre-employment background investigation and must be able to obtain and maintain a Secret level DoD security clearance.

MIT Lincoln Laboratory is an Equal Employment Opportunity (EEO) employer. All qualified applicants will receive consideration for employment and will not be discriminated against on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, age, veteran status, disability status, or genetic information; U.S. citizenship is required.

 

Requisition ID: 41418