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Senior Engineer, Photonic Integrated Circuit Wafer Processing
2 months ago
Infinera is seeking a dedicated and experienced Senior Engineer specializing in Photonic Integrated Circuit (PIC) Wafer Processing. This role is pivotal in developing, qualifying, and optimizing wafer fabrication processes, particularly focusing on thin film deposition for both existing and emerging technology generations.
Key Responsibilities:
- Enhance and refine existing wafer fabrication processes within the PIC facility.
- Lead projects aimed at improving yield, performance, and process control of PICs.
- Collaborate with hardware and process teams to support the roadmap for next-generation PICs, ensuring alignment with customer requirements.
- Implement advanced thin-film deposition techniques to facilitate the development of future PIC technologies that offer superior performance and reliability.
Essential Functions:
- Develop and implement control plans to maintain thin-film deposition processes within specified performance parameters.
- Troubleshoot and resolve wafer fabrication process issues, driving improvements to ensure a seamless production flow.
- Conduct process development within wafer fabrication modules, with a strong emphasis on atomic layer deposition (ALD) for future PIC technologies.
- Engage in cross-functional teams to enhance yields, address process challenges, streamline procedures, and introduce new tools and processes with improved capabilities.
- Work closely with the PIC Line Integration team to advance manufacturing engineering projects related to thin film deposition technology.
- Partner with the PIC R&D team to define, develop, and validate new thin film deposition processes necessary for high-performance multi-Tb PICs.
Qualifications:
- Proficient in JMP, DOE, SPC, and their applications in semiconductor manufacturing.
- Strong understanding of semiconductor fabrication processes, particularly in photolithography, etching, deposition, and related methodologies.
- Excellent communication and problem-solving skills, with a background in semiconductor process development and new process introduction.
- Experience in supporting operations teams, writing and training on fabrication procedures, and conducting root cause analysis.
Preferred Skills:
- In-depth technical knowledge of thin-film deposition tools utilized in semiconductor manufacturing, including physical vapor deposition, evaporation, plasma-enhanced chemical vapor deposition, and atomic layer deposition.
- A minimum of 5 years of experience in various aspects of semiconductor wafer fabrication.
- Ability to clearly communicate challenges and lead the deployment of effective solutions.
- Experience from initial development through to production release.
- Capability to collaborate with integration engineering and development teams on the wafer fabrication engineering roadmap for PIC technology.
- A background in compound semiconductors is advantageous.
Education:
Bachelor's degree with 5 years of experience, or a Master's degree with 3 years of experience, or a Ph.D. with 0-2 years of experience in relevant engineering disciplines such as Electrical Engineering, Chemical Engineering, Materials Engineering, or Metallurgical Engineering.
Infinera is committed to equal opportunity employment. All qualified applicants will receive consideration for employment without regard to race, sex, color, religion, sexual orientation, gender identity, national origin, disability status, protected veteran status, or any other characteristic protected by law.
