Hardware Engineer

2 weeks ago

San Jose, California, United States Broadcom Corporation Full time
Job Description

Broadcom Corporation is seeking a skilled Hardware Engineer to join our team in the Wireless Semiconductor Division (WSD). As a key member of the Packaging Product Support team, you will be responsible for participating in all SIP module build operations, developing and improving SIP assembly processes, and supporting machine PM execution.

Responsibilities
  • Develop and own specific SIP assembly processes, including primary wirebond and Datacon die attach.
  • Backup operation activities of other SIP assembly processes and oversee the entire SIP assembly process flow.
  • Work in the prototype lab to participate in all SIP module build, including hands-on machine programming and operations.
  • Collaborate with R&D, QRE/NPI/FA teams on yield and quality issues, investigating root causes and implementing corrective actions.
  • Initiate and lead continuous process/yield improvement projects with process owners.
  • Manage machine PM and spare parts to prevent machine downtime.
  • Arrange facility work and communicate with facility managers to resolve issues.
  • Manage floor plans, facility requirements, and logistics for new machine installations.
  • Join weekly build plan meetings and update daily build status.
  • Perform design reviews and conduct Design for Manufacturability (DFM) and design rule optimization.
  • Work with packaging engineers on packaging and product development.
Requirements
  • Bachelor's degree in Mechanical, Materials, or Chemical Engineering.
  • 0-2 years of experience in SIP assembly processes (SMT, die attach, wirebonding, molding, grinding, solder ball attach, laser marking, singulation).
  • Hands-on experience with wirebond, Datacon die attach, and other SIP assembly processes, including machine programming and operations.
  • Solid technical understanding of semiconductor packaging materials, material interactions, processes, critical parameters, dominant failure mechanisms, and analytical techniques.
  • Understanding of statistics, control methodology, DOE, troubleshooting, and problem-solving techniques.
  • Good knowledge of packaging industry standards (IPC, JEDEC, IEEE, ISO, ANSI).
  • Good project leading, communication, and presentation skills.
  • A great team member.
  • Experience with AutoCAD is a plus.
Compensation and Benefits

Broadcom offers a competitive and comprehensive benefits package, including medical, dental, and vision plans, 401(K) participation, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company-paid holidays, paid sick leave, and vacation time.

Broadcom is proud to be an equal opportunity employer and welcomes qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status, or any other characteristic protected by federal, state, or local law.

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