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Chemical Mechanical Polishing/Planarization

2 months ago


Mesa Arizona, United States Fujifilm Full time
About the Role

Fujifilm is seeking a highly skilled Technical Manager to lead our Chemical Mechanical Polishing/Planarization (CMP) slurry formulation development team. As a key member of our team, you will be responsible for developing new CMP slurry formulations to meet customer and semiconductor technology node needs.

Key Responsibilities
  • Develop new CMP slurry formulations as per customer and semiconductor technology node requirements.
  • Lead R&D projects to meet customer technical and supporting requirements.
  • Supervise, manage, or lead a technical team (R&D or Application) with experience in CMP slurry chemistries and CMP process.
  • Investigate chemistry and abrasive interactions with different dielectric and metal films.
  • Fine-tune slurry chemistry to achieve desired polishing rates and metrology performance.
  • Apply knowledge of acids, bases, corrosion inhibitors, chemical, particle interactions, electrochemistry, organic, inorganic chemistry, surfactants, and interfacial chemistry to CMP slurry development.
  • Develop CMP slurry formulations for Cu, Ru, Mo, polymer, and silicon-based dielectric/non-metal materials.
  • Conduct literature/IP search, document results, present data to technology team, and file patents.
  • Coordinate with engineering and lab staff on formulation needs with respect to CMP slurry.
  • Provide consultation and technical expertise related to CMP slurries' chemistries to Applications, R&D, and Process Development/Manufacturing teams.
Requirements
  • Ph.D. degree in Chemistry, Surface Chemistry, Material Science, or Colloidal Science.
  • Minimum 5+ years of formulation or semiconductor process experience: preferably in Chemical Mechanical Polishing/Planarization (CMP) slurry chemistries and CMP process.
  • Prior experience leading R&D teams required.
  • Hands-on experience with technical project management.
  • Experience with the semiconductor industry (FEOL/MOL/BEOL), CMP slurries, polishing, and metrology tools, and abrasive particles used in CMP slurries preferred.
  • Analytical abilities, experimental skills, and expertise in chemistry and colloids and interface science required.
  • Previous proven success in formulation development is beneficial.
  • Familiarity with silica abrasives, Zeta Potential, corrosion, surfactants, and electrochemistry desired.
About Fujifilm

Fujifilm is a global leader in chemical solutions for the semiconductor industry and the digital universe. We have a strong presence in the US, Europe, Taiwan, China, Korea, and Japan, with a global workforce of 73,275 employees. We are committed to innovation and excellence in our products and services.