Silicon Packaging Design Engineer
1 week ago
Meta is seeking an experienced Silicon Packaging Design Engineer to join its Ecosystem and Technical Operation team. The successful candidate will be responsible for designing and developing custom silicon packaging solutions for Meta's infrastructure.
The ideal candidate will have a strong background in silicon packaging design, with experience in advanced package design and proficient in Cadence Allegro platform tools or Mentor Xpedition platform tools. They will also have a basic understanding of SI/PI tools, package model extraction, S-parameters, and RLGC models.
The Silicon Packaging Design Engineer will work closely with internal silicon, architecture, and system teams, as well as external partners, to develop holistically optimal solutions. They will be responsible for performing design analysis and what-if scenarios for novel packaging schemes, such as 2.5D/3D and heterogeneous integration, to improve bandwidth, power efficiency, and package form factor.
The successful candidate will have a Bachelor's degree in Computer Science, Computer Engineering, or a relevant technical field, and at least 10 years of experience in advanced silicon packaging design.
Key Responsibilities:
- Design and develop custom silicon packaging solutions for Meta's infrastructure
- Perform design analysis and what-if scenarios for novel packaging schemes
- Collaborate with internal and external teams to develop holistically optimal solutions
- Lead package development to establish package manufacturability and reliability
Requirements:
- Bachelor's degree in Computer Science, Computer Engineering, or a relevant technical field
- At least 10 years of experience in advanced silicon packaging design
- Proficient in Cadence Allegro platform tools or Mentor Xpedition platform tools
- Basic understanding of SI/PI tools, package model extraction, S-parameters, and RLGC models
Preferred Qualifications:
- Master's or PhD degree in Electrical/Materials engineering
- Experience in taking products from concept to prototyping and production
- In-depth knowledge of flip chip, 2.5D, and 3D and wafer packaging technologies
Compensation:
$173,000/year to $249,000/year + bonus + equity + benefits
Industry:
Internet
Equal Opportunity:
Meta is proud to be an Equal Employment Opportunity and Affirmative Action employer. We do not discriminate based upon race, religion, color, national origin, sex (including pregnancy, childbirth, or related medical conditions), sexual orientation, gender, gender identity, gender expression, transgender status, sexual stereotypes, age, status as a protected veteran, status as an individual with a disability, or other applicable legally protected characteristics.
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