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Optical Interconnects Engineer
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We are seeking a dedicated and innovative Silicon Photonics / Optical Packaging Engineer to join our dynamic team. This role is pivotal in advancing Silicon Photonics (SiPh) technology, which is crucial for the development of next-generation optical interconnects.
Key Responsibilities
- Lead the development of SiPh packaging technology.
- Collaborate with cross-functional teams to drive the design of optical engine modules and optical coupling systems.
- Innovate in the area of optical engine package architecture and integration, ensuring efficient assembly and characterization of micro-optical components.
Qualifications
- A strong foundation in optics and photonics fundamentals, along with device/module integration.
- A Bachelor’s degree with a minimum of 10 years of relevant experience is required.
- Proven hands-on experience in packaging and measuring fiber-coupled devices, as well as optical component design and simulation.
Preferred Qualifications
- A Master’s or Ph.D. in Physics (Optics major), Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
- At least 5 years of experience in the field with a Master’s or Ph.D. is preferred.
- Familiarity with CMOS BEOL wafer scale processing and flip chip assembly techniques is advantageous.
Compensation and Benefits
At Apple, we offer a competitive compensation package that includes base pay, stock options, and various benefits. The base pay range for this role is between $175,800 and $312,200, dependent on skills and experience. Employees are also eligible for comprehensive medical and dental coverage, retirement benefits, and reimbursement for educational expenses related to career advancement.
Commitment to Diversity
Apple is an equal opportunity employer committed to fostering an inclusive environment. We take affirmative action to ensure equal opportunity for all applicants.
