Senior Package Design Lead for 3D IC Solutions Engineering

3 days ago


Fremont, California, United States Siemens Digital Industries Software Full time
Job Overview

Siemens Digital Industries Software is seeking a highly skilled and experienced Senior Package Design Lead to join our 3D IC Solutions Engineering team. As a key member of our team, you will be responsible for driving the development of comprehensive, end-to-end workflow solutions supporting the development of advanced 2.5 and 3D System-in-Package (SIP) designs.

Key Responsibilities
  • Drive the development of workflows to support the physical design planning, layout, and verification of advanced 3D IC designs.
  • Develop and maintain expertise in Advanced Packaging IC EDA tools and design methods, including 2.5D and 3D solutions, package design CAD, signal/power integrity analysis, and detailed knowledge of EDA data formats.
  • Collaborate with cross-functional teams to integrate other 3D IC workflows into the 3D IC Physical Design workflow.
  • Provide technical support and guidance to sales, marketing, and design service organizations as required.
Requirements
  • BS or MS in Electrical/Computer Engineering
  • 10 or more years of advanced package physical design and verification experience
  • Working knowledge of Advanced Packaging IC EDA tools and design methods, including 2.5D and 3D solutions, package design CAD, signal/power integrity analysis, and detailed knowledge of EDA data formats
Why Join Us?

At Siemens Digital Industries Software, we offer a dynamic and collaborative work environment, with opportunities for professional growth and development. We are committed to equality and welcome applications from diverse candidates. Join our team and contribute to shaping the future of industrial software.



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