3D IC Solutions Engineer

3 days ago


Fremont, California, United States Siemens Digital Industries Software Full time
Job Title: 3D IC Solutions Engineer

We are seeking a highly skilled and experienced 3D IC Solutions Engineer to join our team at Siemens Digital Industries Software. As a key member of our 3D IC Solutions Engineering team, you will be responsible for driving the development of comprehensive, end-to-end workflow solutions supporting the development of advanced 2.5 and 3D System-in-Package (SIP) designs.

Key Responsibilities:
  • Develop and implement workflow solutions for physical design planning, layout, and verification of advanced 3D IC designs.
  • Collaborate with cross-functional teams to integrate other 3D IC workflows into the 3D IC Physical Design workflow.
  • Provide technical support and guidance to sales, marketing, and design service organizations as required.
Requirements:
  • BS or MS in Electrical/Computer Engineering.
  • 10+ years of advanced package physical design and verification experience.
  • Working knowledge of Advanced Packaging IC EDA tools and design methods, including 2.5D and 3D solutions, package design, signal/power integrity analysis, and EDA data formats.
  • Scripting/programming skills in Python, Tcl, Perl, or similar languages.
Why Join Us?

At Siemens Digital Industries Software, we offer a dynamic and inclusive work environment that values diversity and innovation. Our team is passionate about delivering cutting-edge solutions that transform the way our customers design and manufacture electronic products. If you are a motivated and experienced professional looking for a new challenge, we encourage you to apply for this exciting opportunity.



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