Senior | Principal, AI-Optimized Platform Architect

3 days ago


Folsom, California, United States Micron Technology Full time
Transforming the Future of Computing

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. As a Senior or Principal contributor in our AI-Optimized Memory Platform Architecture team, you will contribute to the definition of platform architecture for groundbreaking, tightly coupled memory systems tailored for AI workloads.

Our team vision is to develop high-performance memory systems that enable the creative career path you deserve with a collaborative environment and groundbreaking technology. We are looking for a talented individual to join our team of domain experts across platforms, systems architecture, component design, and advanced packaging.

Responsibilities will encompass the definition of SoC and IP architectures, evaluation and specification of power delivery architectures, and definition of on- and off-chip interfaces. You will analyze platform architecture trade-offs in close collaboration with design and packaging teams.

Our expectations:
  • Architect SoCs and platform architectures for high-performance stacked memories, including power delivery, interconnects, IOs, and thermals.
  • Collaborate with experts across SoC/memory design, memory systems architecture, and advanced packaging to explore tradeoffs and define architectures and requirements.
  • Create and maintain architecture documentation.
  • Contribute to prototype platform development.
What we're looking for:
  • Experience with platform architecture: analysis, definition, and development of sophisticated systems, especially those constructed with advanced packaging techniques.
  • Experience with high-performance memory devices and memory systems, like HBM.
  • Design and architecture experience with groundbreaking foundry nodes.
  • Experience with 2.5D and 3D interconnects and interfaces, including PCIe, UCIe, and HBM interconnects.
  • Experience with power delivery and thermal architectures and analysis.
What sets candidates apart:
  • Experience with advanced packaging building blocks and techniques.
  • Experience with high efficiency, stacked architectures, and designs.
  • Contributions to system-on-a-chip (SoC) and memory system architecture and design.
  • Ability to influence decisions through data-driven systems analysis.
  • A Masters, PhD, or equivalent experience in Computer Science, Computer Engineering, Electrical Engineering, or related field.
  • 5+ years of proven experience.


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