Principal Engineer

1 day ago


Folsom, California, United States Micron Technology Full time
Job Title: Principal Engineer - HBM Design Architect

At Micron Technology, we're seeking a highly skilled Principal Engineer - HBM Design Architect to join our team. As a key member of our HBM Design Engineering Group, you will be responsible for designing and developing next-generation HBM DRAM products. Your expertise in memory array architectures, high-speed interface design, logic and custom circuit design, memory subsystem operation, high-performance computing architectures, and 2.5D & 3D package integration will be crucial in understanding and analyzing bottlenecks and proposing innovative architectures to target best-in-class performance, power, cost, reliability, and quality for Micron's HBM product portfolio.

Key Responsibilities:
  • Design and develop next-generation HBM DRAM products
  • Collaborate with a distributed team of Design Engineering, Product Engineering, Process Development, Package Engineering & Business Units to implement a common goal of ensuring our future HBM roadmap is successful
  • Apply deep understanding of memory array architectures, high-speed interface design, logic and custom circuit design, memory subsystem operation, high-performance computing architectures, and 2.5D & 3D package integration to understand and analyze bottlenecks and propose innovative architectures
Requirements:
  • Familiarity with DRAM operation and JEDEC specifications, preferably with the HBM product family
  • Knowledge and experience in digital (Verilog) and analog (FastSpice & Hspice) modeling and simulations
  • In-depth technical expertise in one or more areas - DRAM memory array design, high-speed clocking and interface development, logic and custom circuit design, power delivery optimization, CMOS & semiconductor device physics, 2.5D and 3D packaging technologies
  • Proven track record of innovation and problem-solving in high-performance memory development
  • 7+ years of relevant job/skill-related experience
  • Experience delivering highly technical solutions
What Sets You Apart:
  • BSEE or greater
  • In-depth technical expertise in one or more areas: RTL Design flow, in the DRAM process or Foundry process - DRAM product bring-up and debug - package technologies (TSV, hybrid bonding, interposers, etc)
  • Good verbal and written communication skills with the ability to efficiently synthesize and convey sophisticated technical concepts to other partners and leadership
  • A self-motivated, hard-working team player who enjoys working with diverse abilities and backgrounds
  • Having an innovative approach that is open to improving upon any of our processes or products
Location:
  • Folsom, CA
  • Atlanta, GA
  • Allen, TX


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