Dry Etch Process Development Engineer

3 weeks ago


Milpitas, California, United States Headway Technologies Full time

Job Summary:

The Dry Etch Process Development Engineer will be responsible for developing and implementing new dry etch processes for next generation magnetic recording heads. This includes designing and conducting experiments, analyzing data, and presenting findings. The ideal candidate will have a strong understanding of semiconductor or HDD industry principles, practices, and techniques.

Key Responsibilities:

  • Develop and implement new dry etch processes (RIE, IBE, and Ashing) for next generation magnetic recording heads
  • Implement new process control schemes or methodologies which ensure product manufacturability
  • Design and conduct experiments, analyze data, and develop recommendations for improving performance and yield while reducing scrap
  • Adhere to appropriate timeline for introducing new processes into the manufacturing line
  • Review characterization data from FIB, SEM, and TEM tools to conduct root cause analysis and recommend corrective action
  • Partner with other groups and departments, including process and product engineering to develop and deliver products and programs
  • Oversee the work of the Process Technicians to ensure accurate process execution and efficient wafer disposition
  • Partner with Equipment Engineering to research, select, and qualify new RIE tools
  • Adhere to all safety policies and procedures as required

Requirements:

  • Bachelor's degree in Materials Science, Physics, or Electrical Engineering and/or equivalent relevant experience; Master's degree preferred
  • One to three years of experience working in the magnetic recording head, hard disk drive, or semiconductor industry in dry etch process development
  • Experience working in a wafer fab manufacturing environment
  • Experience with Statistical Process Control (SPC)
  • Proficient in the use of Microsoft Office Applications

Working Conditions:

The Dry Etch Process Development Engineer works primarily in an office environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from site-to-site as needed. May also work in a class 100 ESD sensitive wafer fab manufacturing facility; adheres to required safety and dress standards. May be exposed to hazardous chemicals, fumes, or vapors and excessive noise from time-to-time while in the wafer manufacturing facility; stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 10 pounds.



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