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Manufacturing Process Engineer
2 months ago
Position Overview:
The selected candidate will play a crucial role in enhancing manufacturing capabilities for both package and board-level assembly, transitioning from prototype stages to full-scale production. The Manufacturing Engineer will undertake a variety of engineering tasks across different projects within the organization. This role involves independently assessing, selecting, and implementing standard engineering methods, while utilizing sound judgment to adapt and modify as necessary. Clear objectives will guide the assignments, and the position requires a proactive engineer eager to embrace diverse technological challenges.
Key Responsibilities:
- Develop and implement innovative capabilities for board-level processing.
- Work with flexible board assembly techniques, utilizing cutting-edge ultra-thin flexible System on Package (SoP) technologies.
- Define, develop, and optimize equipment and processes for flip-chip thin device assembly.
- Establish manufacturing processes and guidelines for use by team members.
- Collaborate with cross-functional technical teams and clients.
Qualifications:
- Experience in manufacturing related to board assembly, including pick-and-place operations for Surface Mount Technology (SMT) components and die.
- Strong analytical and problem-solving abilities, with familiarity in Statistical Process Control (SPC), JMP, and similar tools.
- Proficient in the use of assembly tools, electronics, robotics, and vision systems.
- Experience with installation, start-up, and maintenance of capital equipment.
- Ability to collaborate effectively with team members.
Preferred Background:
Academic or practical experience with rigid, flexible, or rigid-flex circuit board assemblies, automated flip-chip assembly, stencil printing, or related semiconductor packaging and board assembly processes is advantageous. Interest in advanced packaging technologies, including Flip-Chip Bump (FCB), System in Package (SiP), heterogeneous integration, and chiplets is preferred. The ideal candidate will demonstrate a proactive, innovative, and energetic approach, with a strong can-do attitude. Hands-on experience and the ability to multitask are highly valued, along with a demonstrated aptitude for manufacturing and assembly, whether through professional experience or personal projects involving electronics, electrical systems, or hardware fabrication.
Compensation:
Salary will be commensurate with the level of relevant education and experience. This position may offer stock options as part of the company's growth participation. Medical benefits are included in the overall compensation package.
Career Advancement:
Opportunities for advancement across various corporate functions are available.
Note:
Only candidates willing to relocate at their own expense will be considered. Due to the nature of the work, the ability to obtain and maintain a Department of Defense security clearance is required.
